Seung-Boo Jung

12 papers Journal 12
YearRankTypeTitle / Venue / Authors
2016 J jnl
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications.
Microelectron. Reliab.
Dae Up Kim, Kwang-Seok Kim, Seung-Boo Jung
2014 J jnl
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions.
Microelectron. Reliab.
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
2013 J jnl
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test.
Microelectron. Reliab.
Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung
2008 J jnl
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint.
Microelectron. Reliab.
Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung
2008 J jnl
Effect of surface finish material on printed circuit board for electrochemical migration.
Microelectron. Reliab.
Bo-In Noh, Jong Bum Lee, Seung-Boo Jung
2008 J jnl
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.
Microelectron. Reliab.
Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung
2008 J jnl
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.
Microelectron. Reliab.
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung
2007 J jnl
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
CoRR
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung
2007 J jnl
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package
CoRR
Ja-Myeong Koo, Seung-Boo Jung
2007 J jnl
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging.
Microelectron. Reliab.
Ja-Myeong Koo, Seung-Boo Jung
2006 J jnl
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application.
Microelectron. Reliab.
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
2006 J jnl
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging.
Microelectron. Reliab.
Jeong-Won Yoon, Seung-Boo Jung