| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ISSCC
|
| 2026 | J | jnl |
J. Inf. Secur. Appl.
|
| 2025 | — | conf |
CICC
|
| 2025 | — | conf |
ISSCC
|
| 2025 | J | jnl |
J. King Saud Univ. Comput. Inf. Sci.
|
| 2025 | J | jnl |
Comput. Commun.
|
| 2025 | A | conf |
ICCAD
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
Comput. Networks
|
| 2024 | A | conf |
ICCAD
|
| 2023 | — | conf |
CICC
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | C | conf |
IECON
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | — | conf |
ISSCC
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IET Commun.
|
| 2021 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2020 | — | conf |
ISSCC
|
| 2020 | — | conf |
ISSCC
|
| 2020 | — | conf |
ISSCC
|
| 2020 | — | conf |
ISSCC
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | — | conf |
CICC
|
| 2019 | — | conf |
VLSI Circuits
|
| 2019 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | J | jnl |
Int. J. Netw. Secur.
|
| 2019 | — | conf |
ISSCC
|
| 2019 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2019 | J | jnl |
计算机科学
|
| 2018 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2018 | — | conf |
ISSCC
|
| 2018 | — | conf |
ISSCC
|
| 2018 | J | jnl |
IEEE J. Solid State Circuits
|
| 2018 | J | jnl |
IEEE J. Solid State Circuits
|
| 2018 | J | jnl |
IEEE Commun. Lett.
|
| 2017 | — | conf |
ISSCC
|
| 2017 | — | conf |
ISSCC
|
| 2017 | — | conf |
CICC
|
| 2017 | — | conf |
RWS
|