| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
VTC2025-Spring
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | — | conf |
VTC Fall
|
| 2024 | — | conf |
VTC Fall
|
| 2024 | — | conf |
VTC Fall
|
| 2024 | — | conf |
ITSC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | Misc | conf |
VLSID
|
| 2023 | A* | conf |
ICRA
|
| 2023 | — | conf |
ITSC
|
| 2023 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2022 | — | conf |
GIOTS
|
| 2022 | J | jnl |
CoRR
|
| 2022 | — | conf |
ICC
|
| 2021 | A | conf |
ISLPED
|
| 2021 | C | conf |
IV
|
| 2021 | Misc | conf |
SAC
|
| 2021 | A | conf |
RTSS
|
| 2020 | C | conf |
ICCD
|
| 2020 | — | conf |
ITSC
|
| 2020 | B | conf |
LCTES
|
| 2019 | A | conf |
DATE
|
| 2018 | — | conf |
MOBILESoft@ICSE
|
| 2018 | A | conf |
ICCAD
|
| 2018 | A | conf |
DATE
|
| 2018 | J | jnl |
CoRR
|
| 2018 | A | conf |
ISLPED
|
| 2018 | A | conf |
ICS
|
| 2018 | A | conf |
DATE
|
| 2017 | A | conf |
ISLPED
|
| 2017 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2017 | C | conf |
ICCD
|
| 2016 | A | conf |
ICCAD
|
| 2016 | — | conf |
HLDVT
|
| 2016 | C | conf |
ICCD
|
| 2016 | Misc | conf |
CODES+ISSS
|
| 2014 | A* | conf |
DAC
|
| 2014 | Misc | conf |
CODES+ISSS
|
| 2014 | — | conf |
ASP-DAC
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | A | conf |
ICCAD
|
| 2013 | A* | conf |
DAC
|
| 2013 | A | conf |
ISLPED
|
| 2013 | A | conf |
DATE
|
| 2013 | J | jnl |
Inf. Media Technol.
|
| 2013 | J | jnl |
IPSJ Trans. Syst. LSI Des. Methodol.
|
| 2012 | A | conf |
ISLPED
|
| 2012 | A | conf |
DATE
|
| 2012 | A* | conf |
DAC
|
| 2011 | A | conf |
ICCAD
|
| 2011 | J | jnl |
IEEE J. Emerg. Sel. Topics Circuits Syst.
|
| 2011 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2010 | A | conf |
Dynamic thermal management for networked embedded systems under harsh ambient temperature variation.
ISLPED
|
| 2008 | A | conf |
ICCAD
|
| 2002 | — | conf |
CDC
|