Sandeep Kumar Samal

16 papers A* 2A 6Journal 8

Year	Rank	Type	Title / Venue / Authors
2019	J	`jnl`	Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi
2018	A*	`conf`	Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor. DAC Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim
2017	J	`jnl`	Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2017	A	`conf`	Full chip power benefits with negative capacitance FETs. ISLPED Sandeep Kumar Samal, Sourabh Khandelwal, Asif Islam Khan, Sayeef S. Salahuddin, Chenming Hu, Sung Kyu Lim
2017	J	`jnl`	Improving Performance under Process and Voltage Variations in Near-Threshold Computing Using 3D ICs. ACM J. Emerg. Technol. Comput. Syst. Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim
2017	J	`jnl`	TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava
2017	J	`jnl`	Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
2016	J	`jnl`	Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2016	A	`conf`	How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions. ISLPED Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim
2016	J	`jnl`	Machine Learning Based Variation Modeling and Optimization for 3D ICs. J. Inform. and Commun. Convergence Engineering Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim
2016	A	`conf`	Tier partitioning strategy to mitigate BEOL degradation and cost issues in monolithic 3D ICs. ICCAD Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim
2015	A	`conf`	A Novel Entropy Production Based Full-Chip TSV Fatigue Analysis. ICCAD Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi
2014	J	`jnl`	Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. J. Inform. and Commun. Convergence Engineering Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim
2014	A*	`conf`	Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2014	A	`conf`	Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2013	A	`conf`	Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs. ISLPED Sandeep Kumar Samal, Yarui Peng, Yang Zhang, Sung Kyu Lim