Sandeep Kumar Samal

16 papers A* 2A 6Journal 8
YearRankTypeTitle / Venue / Authors
2019 J jnl
Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi
2018 A* conf
Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor.
DAC
Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim
2017 J jnl
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2017 A conf
Full chip power benefits with negative capacitance FETs.
ISLPED
Sandeep Kumar Samal, Sourabh Khandelwal, Asif Islam Khan, Sayeef S. Salahuddin, Chenming Hu, Sung Kyu Lim
2017 J jnl
Improving Performance under Process and Voltage Variations in Near-Threshold Computing Using 3D ICs.
ACM J. Emerg. Technol. Comput. Syst.
Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim
2017 J jnl
TSV-Based 3-D ICs: Design Methods and Tools.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava
2017 J jnl
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
2016 J jnl
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2016 A conf
How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions.
ISLPED
Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim
2016 J jnl
Machine Learning Based Variation Modeling and Optimization for 3D ICs.
J. Inform. and Commun. Convergence Engineering
Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim
2016 A conf
Tier partitioning strategy to mitigate BEOL degradation and cost issues in monolithic 3D ICs.
ICCAD
Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim
2015 A conf
A Novel Entropy Production Based Full-Chip TSV Fatigue Analysis.
ICCAD
Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi
2014 J jnl
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs.
J. Inform. and Commun. Convergence Engineering
Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim
2014 A* conf
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs.
DAC
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2014 A conf
Full chip impact study of power delivery network designs in monolithic 3D ICs.
ICCAD
Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2013 A conf
Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs.
ISLPED
Sandeep Kumar Samal, Yarui Peng, Yang Zhang, Sung Kyu Lim