Samson Melamed

15 papers A* 2Journal 6Unranked 7
YearRankTypeTitle / Venue / Authors
2017 J jnl
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.
Microelectron. Reliab.
Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
2016 J jnl
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.
Microelectron. Reliab.
Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
2015 J jnl
Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit.
Microelectron. J.
Samson Melamed, Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Michiya Hagimoto, Yukoh Matsumoto, Masahiro Aoyagi
2015 — conf
Investigation of effects of metalization on heat spreading in bump-bonded 3D systems.
3DIC
Samson Melamed, Katsuya Kikuchi, Masahiro Aoyagi
2012 J jnl
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels.
IET Circuits Devices Syst.
Shivam Priyadarshi, T. Robert Harris, Samson Melamed, Carlos Tadeo Ortega Otero, Nikhil Kriplani, Carlos E. Christoffersen, Rajit Manohar, Steven R. Dooley, W. Rhett Davis, Paul D. Franzon, Michael B. Steer
2012 J jnl
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Samson Melamed, Thorlindur Thorolfsson, T. Robert Harris, Shivam Priyadarshi, Paul D. Franzon, Michael B. Steer, W. Rhett Davis
2011 — conf
3D Specific Systems: Design and CAD.
Asian Test Symposium
Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed
2011 — conf
3D specific systems design and CAD.
ICSAMOS
Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed
2011 — conf
Pathfinder 3D: A flow for system-level design space exploration.
3DIC
Shivam Priyadarshi, Jianchen Hu, Won Ha Choi, Samson Melamed, Xi Chen, W. Rhett Davis, Paul D. Franzon
2010 J jnl
Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration.
ACM Trans. Design Autom. Electr. Syst.
Thorlindur Thorolfsson, Samson Melamed, W. Rhett Davis, Paul D. Franzon
2009 — conf
Comparative analysis of two 3D integration implementations of a SAR processor.
3DIC
Thorlindur Thorolfsson, Samson Melamed, Gary Charles, Paul D. Franzon
2009 — conf
Junction-level thermal extraction and simulation of 3DICs.
3DIC
Samson Melamed, Thorlindur Thorolfsson, Adi Srinivasan, Edmund Cheng, Paul D. Franzon, William Rhett Davis
2008 A* conf
Design and CAD for 3D integrated circuits.
DAC
Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller
2008 — conf
Inter-die signaling in three dimensional integrated circuits.
CICC
Christopher Mineo, Ravi Jenkal, Samson Melamed, W. Rhett Davis
2006 A* conf
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.
DAC
Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis