Sai Pentapati - RankMe

15 papers A 3Journal 8Unranked 4

Year	Rank	Type	Title / Venue / Authors
2024	J	`jnl`	Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs. IEEE Trans. Very Large Scale Integr. Syst. Sai Pentapati, Sung Kyu Lim
2024	J	`jnl`	On Legalization of Die Bonding Bumps and Pads for 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Yen-Hsiang Huang, Sai Pentapati, Anthony Agnesina, Moritz Brunion, Sung Kyu Lim
2024	J	`jnl`	Pin-3D: Effective Physical Design Methodology for Multidie Co-Optimization in Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sai Pentapati, Kyungwook Chang, Sung Kyu Lim
2023	J	`jnl`	ECO-GNN: Signoff Power Prediction Using Graph Neural Networks with Subgraph Approximation. ACM Trans. Design Autom. Electr. Syst. Yi-Chen Lu, Siddhartha Nath, Sai Pentapati, Sung Kyu Lim
2023	—	`conf`	On Legalization of Die Bonding Bumps and Pads for 3D ICs. ISPD Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim
2023	J	`jnl`	Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Yun Heo, Jae-Seung Choi, Sung Kyu Lim
2022	J	`jnl`	A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim
2022	J	`jnl`	Metal Layer Sharing: A Routing Optimization Technique for Monolithic 3D ICs. IEEE Trans. Very Large Scale Integr. Syst. Sai Pentapati, Sung Kyu Lim
2022	—	`conf`	Routing Layer Sharing: A New Opportunity for Routing Optimization in Monolithic 3D ICs. ISPD Sai Pentapati, Sung Kyu Lim
2021	—	`conf`	Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISPD Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim
2021	—	`conf`	The Law of Attraction: Affinity-Aware Placement Optimization using Graph Neural Networks. ISPD Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim
2020	A	`conf`	Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs. DATE Lennart Bamberg, Alberto García Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim
2019	J	`jnl`	A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology. IEEE Micro Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto García Ortiz, Sung Kyu Lim
2019	A	`conf`	Tier Partitioning and Flip-flop Relocation Methods for Clock Trees in Monolithic 3D ICs. ISLPED Da Eun Shim, Sai Pentapati, Jeehyun Lee, Yun Seop Yu, Sung Kyu Lim
2018	A	`conf`	Road to High-Performance 3D ICs: Performance Optimization Methodologies for Monolithic 3D ICs. ISLPED Kyungwook Chang, Sai Pentapati, Da Eun Shim, Sung Kyu Lim