| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEICE Trans. Electron.
|
| 2025 | J | jnl |
Investigation of Molding Conditions for CNT Composite Phenolic Resin Bond by Solvent Casting Method.
Int. J. Autom. Technol.
|
| 2022 | J | jnl |
Int. J. Inf. Sec.
|
| 2022 | C | conf |
ICCE
|
| 2021 | J | jnl |
CoRR
|
| 2019 | — | conf |
SIGGRAPH ASIA Emerging Technologies
|
| 2019 | — | conf |
AsiaJCIS
|
| 2019 | J | jnl |
Neural Networks
|
| 2019 | B | conf |
SAS
|
| 2018 | J | jnl |
SIAM J. Math. Anal.
|
| 2014 | — | conf |
ASAP
|
| 2014 | J | jnl |
FPGA-based Custom Computing Architecture for Large-Scale Fluid Simulation with Building Cube Method.
SIGARCH Comput. Archit. News
|
| 2014 | J | jnl |
CoRR
|
| 2013 | J | jnl |
Int. J. Autom. Technol.
|
| 2013 | J | jnl |
SIGARCH Comput. Archit. News
|
| 2013 | B | conf |
FPL
|
| 2012 | B | conf |
IJCNN
|
| 2011 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2011 | — | conf |
ICONIP (2)
|
| 2010 | B | conf |
IJCNN
|