| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2025 | J | jnl |
Comput. Biol. Medicine
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Reliability and maintenance modeling for a production system by means of point process observations.
Ann. Oper. Res.
|
| 2023 | J | jnl |
Comput. Ind. Eng.
|
| 2023 | B | conf |
IJCNN
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | A | conf |
MODELS
|
| 2023 | — | conf |
SemEval@ACL
|
| 2022 | J | jnl |
Comput. Ind. Eng.
|
| 2022 | J | jnl |
Comput. Ind. Eng.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Reliab.
|
| 2020 | — | conf |
SmartGridComm
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
J. Oper. Res. Soc.
|
| 2020 | J | jnl |
Int. J. Wavelets Multiresolution Inf. Process.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Comput. Ind. Eng.
|
| 2019 | — | conf |
ESEC/SIGSOFT FSE
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2019 | — | — |
|
| 2019 | A* | conf |
ASE
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2018 | B | conf |
ECMFA
|
| 2018 | A | conf |
MoDELS
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2017 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2016 | — | conf |
EIT
|
| 2016 | — | conf |
EIT
|
| 2016 | — | conf |
EduSymp/OSS4MDE@MoDELS
|
| 2015 | — | conf |
FTfJP@ECOOP
|
| 2015 | — | conf |
EIT
|
| 2014 | C | conf |
IECON
|
| 2014 | J | jnl |
IEEE Trans. Smart Grid
|
| 2014 | J | jnl |
Ann. Oper. Res.
|
| 2012 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2012 | C | conf |
IECON
|
| 2011 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2010 | J | jnl |
Int. J. Bifurc. Chaos
|
| 2003 | J | jnl |
Oper. Res.
|