| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
ACM Trans. Storage
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Knowl. Data Eng.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Netw.
|
| 2026 | A | conf |
FAST
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Computers
|
| 2025 | A* | conf |
OSDI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
FAST
|
| 2025 | — | conf |
ACL (Findings)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
ACM Trans. Storage
|
| 2025 | A | conf |
FAST
|
| 2025 | A* | conf |
ICDE
|
| 2025 | A* | conf |
HPCA
|
| 2025 | A | conf |
SC
|
| 2025 | Misc | conf |
ICASSP
|
| 2024 | — | conf |
ICESS
|
| 2024 | — | conf |
DASFAA (2)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Image Process.
|
| 2024 | B | conf |
ICPP
|
| 2023 | — | conf |
ICONIP (13)
|
| 2023 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2022 | J | jnl |
Microprocess. Microsystems
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | C | conf |
ICCD
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | J | jnl |
J. Syst. Archit.
|
| 2021 | — | conf |
SSCI
|
| 2021 | J | jnl |
IEEE Trans. Computers
|
| 2020 | J | jnl |
IEEE Internet Things J.
|
| 2020 | — | conf |
NVMSA
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
HPCC/DSS/SmartCity
|
| 2020 | Misc | conf |
CODES+ISSS
|
| 2020 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2020 | — | conf |
ICONIP (1)
|
| 2019 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | — | conf |
HPCC/SmartCity/DSS
|
| 2019 | J | jnl |
J. Syst. Archit.
|
| 2019 | J | jnl |
J. Syst. Archit.
|
| 2019 | A* | conf |
DAC
|
| 2019 | A* | conf |
MICRO
|
| 2018 | Misc | conf |
ICASSP
|
| 2018 | J | jnl |
J. Syst. Archit.
|
| 2018 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2018 | — | conf |
WWW (Companion Volume)
|
| 2017 | J | jnl |
IEEE Trans. Computers
|
| 2017 | — | conf |
ISWC (Posters, Demos & Industry Tracks)
|
| 2017 | J | jnl |
IEEE Trans. Computers
|
| 2017 | — | conf |
WWW (Companion Volume)
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | J | jnl |
IEEE Trans. Multi Scale Comput. Syst.
|
| 2016 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2016 | A* | conf |
MICRO
|
| 2016 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2016 | — | conf |
ASP-DAC
|
| 2016 | J | jnl |
Softw. Pract. Exp.
|
| 2016 | J | jnl |
Future Gener. Comput. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Computers
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | — | conf |
HPCC/CSS/ICESS
|
| 2014 | A* | conf |
DAC
|
| 2014 | J | jnl |
Softw. Pract. Exp.
|
| 2014 | — | conf |
NVMSA
|
| 2013 | Misc | conf |
CODES+ISSS
|
| 2013 | B | conf |
RTCSA
|
| 2012 | — | conf |
HPCC-ICESS
|
| 2012 | B | conf |
TrustCom
|