Rao R. Tummala

13 papers C 1Journal 7Unranked 5
YearRankTypeTitle / Venue / Authors
2018 J jnl
Miniaturized and high-performance RF packages with ultra-thin glass substrates.
Microelectron. J.
Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala
2017 J jnl
System Scaling With Nanostructured Power and RF Components.
Proc. IEEE
Markondeya Raj Pulugurtha, Himani Sharma, Srikrishna Sitaraman, Dibyajat Mishra, Rao R. Tummala
2014 — conf
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.
3DIC
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala
2013 — conf
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.
3DIC
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
2013 — conf
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.
3DIC
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
2013 J jnl
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.
Microelectron. Reliab.
Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman
2009 — conf
Electrical modeling of Through Silicon and Package Vias.
3DIC
Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala
2009 — conf
Trend from ICs to 3D ICs to 3D systems.
CICC
Rao R. Tummala, Venky Sundaram, Ritwik Chatterjee, P. Markodeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Vikay Sridharan, Abhishek Choudury, Qiao Chen, Tapobrata Bandyopadhyay
2004 J jnl
Gigabit wireless: system-on-a-package technology.
Proc. IEEE
Rao R. Tummala, Joy Laskar
1999 J jnl
System on Chip or System on Package?
IEEE Des. Test Comput.
Rao R. Tummala, Vijay K. Madisetti
1992 J jnl
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
IBM J. Res. Dev.
Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond
1992 J jnl
Multichip packaging-a tutorial.
Proc. IEEE
Rao R. Tummala
1991 C conf
High Performance Packaged Electronics for the IBM ES9000
ICCD
Arnold E. Barish, James P. Eckhardt, Mark D. Mayo, Walter A. Svarczkopf, Santosh P. Gaur, Rao R. Tummala