| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Environ. Model. Softw.
|
| 2026 | J | jnl |
IEEE Trans. Software Eng.
|
| 2026 | J | jnl |
Inf. Softw. Technol.
|
| 2026 | J | jnl |
Environ. Model. Softw.
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
ACM Trans. Softw. Eng. Methodol.
|
| 2025 | J | jnl |
Inf. Softw. Technol.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ICSE
|
| 2025 | — | conf |
PRICAI (4)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Software Eng.
|
| 2025 | J | jnl |
Leveraging Modular Architecture for Bug Characterization and Analysis in Automated Driving Software.
ACM Trans. Softw. Eng. Methodol.
|
| 2025 | C | conf |
SEKE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Inf. Softw. Technol.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Inf. Softw. Technol.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
J. Syst. Softw.
|
| 2024 | — | conf |
ICMLSC
|
| 2024 | J | jnl |
Int. J. Medical Informatics
|
| 2023 | A* | conf |
ASE
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
ACM Trans. Softw. Eng. Methodol.
|
| 2023 | J | jnl |
J. Softw. Evol. Process.
|
| 2023 | C | conf |
SEKE
|
| 2023 | A | conf |
ICPC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A | conf |
ESEM
|
| 2023 | J | jnl |
CoRR
|
| 2022 | C | conf |
SEKE
|
| 2022 | J | jnl |
Inf. Softw. Technol.
|
| 2022 | J | jnl |
IEEE Trans. Software Eng.
|
| 2022 | A | conf |
ICPC
|
| 2022 | J | jnl |
J. Syst. Softw.
|
| 2022 | J | jnl |
Inf. Softw. Technol.
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Software Eng.
|
| 2021 | C | conf |
SCAM
|
| 2021 | A | conf |
ICPC
|
| 2021 | J | jnl |
CoRR
|
| 2021 | Misc | conf |
SETTA
|
| 2021 | J | jnl |
IEEE Trans. Software Eng.
|
| 2021 | A | conf |
ESEM
|
| 2020 | J | jnl |
Sensors
|
| 2020 | C | conf |
SEKE
|
| 2020 | C | conf |
SEKE
|
| 2020 | J | jnl |
Inf. Softw. Technol.
|
| 2020 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | A | conf |
ICSME
|
| 2020 | J | jnl |
Int. J. Softw. Eng. Knowl. Eng.
|
| 2019 | — | conf |
TrustCom/BigDataSE
|
| 2019 | — | conf |
ISIE
|
| 2019 | J | jnl |
IEEE Trans. Software Eng.
|
| 2019 | C | conf |
APSEC
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | B | conf |
SEAA
|
| 2018 | A | conf |
ICPC
|
| 2018 | A* | conf |
ASE
|
| 2018 | J | jnl |
IEEE Trans. Smart Grid
|
| 2018 | B | conf |
ECSA
|
| 2018 | A | conf |
ESEM
|
| 2016 | A* | conf |
ICSE
|
| 2016 | A* | conf |
ICSE
|
| 2016 | — | conf |
WICSA
|
| 2015 | — | conf |
ICSE (2)
|
| 2015 | — | conf |
WICSA
|
| 2013 | — | conf |
MTD@ICSE
|