| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | A | conf |
DATE
|
| 2023 | A | conf |
DATE
|
| 2022 | C | conf |
FDL
|
| 2019 | — | conf |
MECO
|
| 2018 | — | conf |
PECCS
|
| 2017 | J | jnl |
Sensors
|
| 2017 | C | conf |
IECON
|
| 2016 | — | conf |
ARCS
|
| 2016 | — | conf |
CSE/EUC/DCABES
|
| 2016 | Misc | conf |
EICS
|
| 2015 | — | conf |
IoT 360 (2)
|
| 2014 | — | conf |
MBMV
|
| 2012 | C | conf |
VLSI-SoC
|
| 2012 | J | jnl |
IBM J. Res. Dev.
|
| 2010 | A | conf |
DATE
|
| 2010 | — | conf |
MBMV
|
| 2009 | J | jnl |
IBM J. Res. Dev.
|
| 2007 | — | conf |
MBMV
|
| 2006 | A | conf |
DATE
|
| 2005 | — | conf |
ISCAS (3)
|
| 2002 | A | conf |
ITC
|
| 2002 | — | conf |
ETW
|
| 2002 | J | jnl |
J. Electron. Test.
|
| 2001 | — | conf |
ETW
|
| 2001 | A | conf |
ITC
|
| 2001 | A | conf |
DATE
|
| 1998 | A | conf |
ITC
|