| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | A | conf |
ICCAD
|
| 2023 | A | conf |
DATE
|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
IEEE Des. Test
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | C | conf |
ACC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A | conf |
ISLPED
|
| 2022 | J | jnl |
Ad Hoc Networks
|
| 2021 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | — | conf |
MECO
|
| 2021 | A | conf |
ICCAD
|
| 2021 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Des. Test
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | — | conf |
SLIP
|
| 2020 | J | jnl |
IEEE Des. Test
|
| 2020 | A | conf |
ICCAD
|
| 2020 | J | jnl |
CoRR
|
| 2020 | — | conf |
ICIOT
|
| 2020 | — | conf |
DSN (Supplements)
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2019 | C | conf |
ICCD
|
| 2018 | J | jnl |
IEEE Trans. Computers
|
| 2018 | J | jnl |
IEEE Trans. Multi Scale Comput. Syst.
|
| 2018 | A* | conf |
DAC
|
| 2017 | — | conf |
ANDARE@PACT
|
| 2017 | J | jnl |
Syst. Control. Lett.
|
| 2017 | A* | conf |
DAC
|
| 2017 | J | jnl |
Autom.
|
| 2017 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | — | conf |
CDC
|
| 2015 | A* | conf |
DAC
|
| 2015 | Misc | conf |
CASES
|
| 2015 | — | conf |
CDC
|
| 2015 | C | conf |
ACC
|
| 2014 | Misc | conf |
CASES
|
| 2014 | — | conf |
SoCC
|
| 2013 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2013 | C | conf |
ICCD
|
| 2011 | — | — |
|
| 2010 | — | conf |
Performance and energy efficient cache migrationapproach for thermal management in embedded systems.
ACM Great Lakes Symposium on VLSI
|
| 2009 | — | conf |
ASAP
|
| 2007 | C | conf |
ICCD
|
| 2005 | — | conf |
ASP-DAC
|
| 2004 | — | conf |
SoCC
|