| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Electron. Commer. Res.
|
| 2025 | J | jnl |
Electron. Mark.
|
| 2024 | J | jnl |
Inf. Manag.
|
| 2023 | J | jnl |
Trans. Emerg. Telecommun. Technol.
|
| 2023 | — | conf |
HCI (29)
|
| 2023 | J | jnl |
J. Organ. End User Comput.
|
| 2023 | J | jnl |
Inf. Process. Manag.
|
| 2022 | J | jnl |
J. Comput. Appl. Math.
|
| 2022 | B | conf |
IEEE Big Data
|
| 2022 | — | conf |
ICEB
|
| 2022 | — | conf |
ICEB
|
| 2021 | J | jnl |
Appl. Soft Comput.
|
| 2021 | — | conf |
ITQM
|
| 2021 | J | jnl |
J. Comput. Appl. Math.
|
| 2021 | J | jnl |
Decis. Support Syst.
|
| 2021 | — | conf |
HCI (35)
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
J. Inf. Sci.
|
| 2019 | J | jnl |
Inf. Process. Manag.
|
| 2018 | J | jnl |
Complex.
|
| 2016 | — | conf |
PACIS
|
| 2014 | — | conf |
I3E
|