| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Supercomput.
|
| 2026 | J | jnl |
Image Vis. Comput.
|
| 2026 | J | jnl |
Pattern Anal. Appl.
|
| 2026 | J | jnl |
npj Digit. Medicine
|
| 2025 | J | jnl |
Geo spatial Inf. Sci.
|
| 2025 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2024 | J | jnl |
Intell. Data Anal.
|
| 2024 | J | jnl |
Knowl. Based Syst.
|
| 2024 | J | jnl |
Enhancing open-set domain adaptation through unknown-filtering multi-classifier adversarial network.
Image Vis. Comput.
|
| 2024 | J | jnl |
Neural Networks
|
| 2024 | J | jnl |
Signal Image Video Process.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
Intell. Data Anal.
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
Knowl. Based Syst.
|
| 2023 | J | jnl |
IEEE Commun. Lett.
|
| 2023 | J | jnl |
Neural Process. Lett.
|
| 2023 | J | jnl |
Inf. Sci.
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
EITCE
|
| 2023 | J | jnl |
Frontiers Comput. Sci.
|
| 2022 | B | conf |
IJCB
|
| 2022 | J | jnl |
Vis. Comput.
|
| 2022 | — | conf |
CCBR
|
| 2022 | J | jnl |
Multim. Tools Appl.
|
| 2022 | J | jnl |
J. Electronic Imaging
|
| 2022 | B | conf |
IJCB
|
| 2022 | J | jnl |
Knowl. Based Syst.
|
| 2022 | J | jnl |
Int. J. Mach. Learn. Cybern.
|
| 2022 | J | jnl |
Database J. Biol. Databases Curation
|
| 2021 | J | jnl |
Future Gener. Comput. Syst.
|
| 2021 | J | jnl |
Neurocomputing
|
| 2021 | — | conf |
DMBD (1)
|
| 2021 | — | conf |
ICAIIS
|
| 2020 | J | jnl |
KSII Trans. Internet Inf. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Image Process.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | C | conf |
IGARSS
|
| 2020 | J | jnl |
Frontiers Comput. Sci.
|
| 2020 | — | conf |
ICDEL
|
| 2020 | J | jnl |
J. Real Time Image Process.
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
Math. Comput. Simul.
|
| 2019 | J | jnl |
Clust. Comput.
|
| 2019 | J | jnl |
Sci. Eng. Ethics
|
| 2019 | J | jnl |
Clust. Comput.
|
| 2018 | J | jnl |
Ann. GIS
|
| 2018 | — | conf |
ICCCS (6)
|
| 2018 | J | jnl |
Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.
IEEE Trans. Ind. Informatics
|
| 2018 | J | jnl |
Algorithms
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | C | conf |
CIS
|
| 2015 | J | jnl |
Appl. Math. Comput.
|
| 2015 | J | jnl |
Appl. Math. Comput.
|
| 2014 | J | jnl |
J. Multim.
|
| 2014 | J | jnl |
J. Comput.
|
| 2013 | J | jnl |
J. Softw.
|
| 2013 | J | jnl |
Commun. Res.
|
| 2013 | J | jnl |
Int. J. Online Biomed. Eng.
|
| 2012 | — | conf |
CCIS
|
| 2011 | J | jnl |
Trans. Edutainment
|
| 2010 | — | conf |
BIBM Workshops
|
| 2002 | A* | conf |
INFOCOM
|
| 2002 | B | conf |
WCNC
|
| 2002 | J | jnl |
Comput. Networks
|
| 2000 | B | conf |
WCNC
|