| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | — | conf |
IEEE SENSORS
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | — | conf |
IEEE SENSORS
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
SENSORS
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
Low-Drift MEMS Thermal Wind Sensor With Symmetric Packaging Using Plastic Injection Molding Process.
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
Sensors
|
| 2019 | — | conf |
IEEE SENSORS
|
| 2019 | — | conf |
IEEE SENSORS
|
| 2019 | J | jnl |
J. Sensors
|
| 2019 | — | conf |
IEEE SENSORS
|
| 2019 | — | conf |
IEEE SENSORS
|
| 2018 | — | conf |
NEMS
|
| 2018 | — | conf |
IEEE SENSORS
|
| 2018 | — | conf |
IEEE SENSORS
|
| 2018 | J | jnl |
J. Sensors
|
| 2018 | — | conf |
NEMS
|
| 2017 | J | jnl |
Sensors
|
| 2017 | — | conf |
IEEE SENSORS
|
| 2017 | — | conf |
IEEE SENSORS
|
| 2017 | — | conf |
ASICON
|
| 2016 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2016 | — | conf |
IEEE SENSORS
|
| 2016 | — | conf |
IEEE SENSORS
|
| 2016 | J | jnl |
Micromachines
|
| 2016 | J | jnl |
Sensors
|
| 2015 | — | conf |
NEMS
|
| 2015 | J | jnl |
IEEE Internet Things J.
|
| 2015 | J | jnl |
Sensors
|
| 2014 | J | jnl |
IEEE Internet Things J.
|
| 2014 | — | conf |
NEMS
|
| 2013 | — | conf |
NEMS
|
| 2013 | — | conf |
NEMS
|
| 2009 | — | conf |
NEMS
|
| 2009 | J | jnl |
Sensors
|
| 2007 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|