| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2024 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2023 | B | conf |
ICIP
|
| 2023 | Misc | conf |
MVA
|
| 2023 | Misc | conf |
ICASSP
|
| 2022 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
Texture and exposure awareness based refill for HDRI reconstruction of saturated and occluded areas.
IET Image Process.
|
| 2020 | A* | conf |
ASE
|
| 2020 | B | conf |
ICPR
|
| 2017 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2017 | B | conf |
ICIP
|
| 2015 | — | conf |
APSIPA
|
| 2014 | — | conf |
APSIPA
|
| 2010 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2010 | B | conf |
MMM
|
| 2010 | — | conf |
ICCSA Workshops
|
| 2009 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2009 | A | conf |
ICME
|
| 2009 | — | conf |
EUSIPCO
|
| 2009 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2009 | C | conf |
MMSP
|
| 2009 | J | jnl |
IPSJ Trans. Syst. LSI Des. Methodol.
|
| 2009 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2009 | B | conf |
ICIP
|
| 2009 | C | conf |
MMSP
|
| 2009 | — | conf |
EUSIPCO
|
| 2009 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2009 | — | conf |
DPS
|
| 2009 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2008 | J | jnl |
IEICE Trans. Electron.
|
| 2008 | B | conf |
ICIP
|
| 2008 | — | conf |
APCCAS
|
| 2008 | — | conf |
EUSIPCO
|
| 2008 | C | conf |
MMSP
|
| 2008 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2008 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|