| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2025 | J | jnl |
J. Electr. Comput. Eng.
|
| 2025 | J | jnl |
J. Chem. Inf. Model.
|
| 2025 | J | jnl |
SN Comput. Sci.
|
| 2024 | J | jnl |
J. Syst. Archit.
|
| 2024 | J | jnl |
IET Wirel. Sens. Syst.
|
| 2024 | — | conf |
IC3I
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
Int. J. Syst. Assur. Eng. Manag.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | — | conf |
DSC
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | Misc | conf |
UCC
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
Wirel. Pers. Commun.
|
| 2023 | J | jnl |
J. Sens. Actuator Networks
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
Wirel. Pers. Commun.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | J | jnl |
Int. J. Softw. Sci. Comput. Intell.
|
| 2022 | J | jnl |
Educ. Inf. Technol.
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Int. J. Syst. Assur. Eng. Manag.
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
IC3I
|
| 2022 | — | conf |
IC3I
|
| 2021 | J | jnl |
KSII Trans. Internet Inf. Syst.
|
| 2021 | J | jnl |
Ingénierie des Systèmes d Inf.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Ingénierie des Systèmes d Inf.
|
| 2021 | J | jnl |
Remote. Sens.
|
| 2021 | J | jnl |
Int. J. Adv. Oper. Manag.
|
| 2021 | J | jnl |
Wirel. Pers. Commun.
|
| 2020 | — | conf |
MIND (2)
|
| 2020 | — | conf |
SoCPaR
|
| 2020 | J | jnl |
Soft Comput.
|
| 2020 | J | jnl |
Wirel. Pers. Commun.
|
| 2020 | J | jnl |
Wirel. Pers. Commun.
|
| 2020 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2019 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2019 | J | jnl |
Wirel. Pers. Commun.
|
| 2019 | — | conf |
ICACDS (2)
|
| 2019 | J | jnl |
Int. J. Manuf. Mater. Mech. Eng.
|
| 2018 | J | jnl |
Comput. Commun.
|
| 2018 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2017 | — | conf |
ICTON
|
| 2017 | — | conf |
ICITKM
|
| 2017 | — | conf |
ICIIS
|
| 2017 | — | conf |
ICTON
|
| 2017 | J | jnl |
Int. J. Comput. Aided Eng. Technol.
|
| 2017 | J | jnl |
Wirel. Pers. Commun.
|
| 2016 | J | jnl |
Int. J. Commun. Syst.
|
| 2016 | J | jnl |
IET Networks
|
| 2015 | J | jnl |
Int. J. Comput. Aided Eng. Technol.
|
| 2015 | B | conf |
SOFTii: Soft Tangible Interface for Continuous Control of Virtual Objects with Pressure-based Input.
TEI
|
| 2013 | — | conf |
VDAT
|
| 2013 | — | conf |
PHOTOPTICS
|
| 2011 | J | jnl |
Int. J. Medical Eng. Informatics
|
| 2009 | B | conf |
ICIP
|
| 2008 | — | conf |
IPCV
|
| 2007 | — | conf |
VISAPP (1)
|
| 2007 | — | conf |
VISAPP (1)
|
| 2006 | — | conf |
VISAPP (1)
|
| 2000 | J | jnl |
IEEE Trans. Image Process.
|
| 1999 | Misc | conf |
VLSI Design
|