Peter J. Zampardi

13 papers Journal 10Unranked 3
YearRankTypeTitle / Venue / Authors
2023 — conf
Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors.
PRIME
Ciro Scognamillo, Antonio Pio Catalano, Vincenzo d'Alessandro, Peter J. Zampardi, Kerry Burger
2021 — conf
From Transistor Parameters to PA Circuit Performance (Invited).
BCICTS
Peter J. Zampardi
2017 J jnl
Determination of safe reliability region over temperature and current density for through wafer vias.
Microelectron. Reliab.
Charles S. Whitman, Michael G. Meeder, Peter J. Zampardi
2017 J jnl
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies.
Microelectron. Reliab.
Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi
2013 J jnl
Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers.
Microelectron. Reliab.
Andre G. Metzger, Vincenzo d'Alessandro, Niccolò Rinaldi, Peter J. Zampardi
2012 J jnl
Formulations and a Computer-Aided Test Method for the Estimation of IMD Levels in an Envelope Feedback RFIC Power Amplifier.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Nicolas G. Constantin, Kai H. Kwok, Hongxiao Shao, Cristian Cismaru, Peter J. Zampardi
2012 J jnl
Measuring seam/crack formation in interconnect metallization.
Microelectron. Reliab.
Peter J. Zampardi, Cristian Cismaru, Hal Banbrook, Bin Li
2010 — conf
Will CMOS amplifiers ever Kick-GaAs?
CICC
Peter J. Zampardi
2007 J jnl
An InGaP/GaAs Merged HBT-FET (BiFET) Technology and Applications to the Design of Handset Power Amplifiers.
IEEE J. Solid State Circuits
Andre G. Metzger, Ravi Ramanathan, Jiang Li, Hsiang-Chih Sun, Cristian Cismaru, Hongxiao Shao, Lance Rushing, Kenneth P. Weller, Ce-Jun Wei, Yu Zhu, Alexei Klimashov, Yevgeniy A. Tkachenko, Bin Li, Peter J. Zampardi
2007 J jnl
Introduction to the Special Issue on the Third IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).
IEEE J. Solid State Circuits
Peter Katzin, Peter J. Zampardi
2006 J jnl
Characterization, design, modeling, and model validation of silicon-wafer M: N balun components under matched and unmatched conditions.
IEEE J. Solid State Circuits
Francis M. Rotella, Cristian Cismaru, Yevgeniy Gene Tkachenko, Yuhua Cheng, Peter J. Zampardi
2004 J jnl
A comparison of linear handset power amplifiers in different bipolar technologies.
IEEE J. Solid State Circuits
Keith Nellis, Peter J. Zampardi
1995 J jnl
HBT transmitter and data regenerator arrays for WDM optical communications application.
IEEE J. Solid State Circuits
Kenneth D. Pedrotti, F. Zucca, Peter J. Zampardi, K. Nary, Steve M. Beccue, Klaus Runge, D. Meeker, J. Penny, K. C. Wang