| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2026 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
MLSP
|
| 2025 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2025 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Commun.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE J. Sel. Areas Commun.
|
| 2025 | — | conf |
ACL (1)
|
| 2024 | — | conf |
MLSP
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2024 | J | jnl |
IEEE Trans. Commun.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Soc. Syst.
|
| 2024 | J | jnl |
IEEE Wirel. Commun.
|
| 2024 | A* | conf |
EMNLP
|
| 2023 | — | conf |
ISSCC
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | B | conf |
GLOBECOM
|
| 2023 | B | conf |
GLOBECOM
|
| 2023 | J | jnl |
IEEE J. Sel. Areas Commun.
|
| 2023 | J | jnl |
IEEE Wirel. Commun.
|
| 2022 | — | conf |
MLSP
|
| 2022 | J | jnl |
IEEE Trans. Commun.
|
| 2021 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2021 | J | jnl |
IEEE Trans. Commun.
|
| 2020 | J | jnl |
J. Commun. Inf. Networks
|
| 2018 | J | jnl |
CoRR
|