Olivér Krammer

11 papers C 1Journal 9Unranked 1
YearRankTypeTitle / Venue / Authors
2024 — conf
Assessing Temperature Sensitivity and Ring Oscillator Count Impact on Configurable Ring Oscillator PUF Performance.
MECO
Husam Kareem, Olivér Krammer, Dmitriy Dunaev
2023 J jnl
Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors.
Sensors
Zoltán Tafferner, Balázs Illés, Olivér Krammer, Attila Géczy
2022 J jnl
Analyzing the Overfitting of Boosted Decision Trees for the Modelling of Stencil Printing.
Period. Polytech. Electr. Eng. Comput. Sci.
Péter Martinek, Olivér Krammer
2019 J jnl
Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology.
Comput. Ind. Eng.
Péter Martinek, Olivér Krammer
2018 C conf
Microelectronics education in Europe in 21
EDUCON
Slavka Tzanova, Attila Géczy, Olivér Krammer, Péter Martinek, Zholt Lyefalvi-Vitez, Mile Stankovski, Rosario Gil, Manuel Castro Gil, Norocel Codreanu
2017 J jnl
Automatic characterisation method for statistical evaluation of tin whisker growth.
Microelectron. Reliab.
Olivér Krammer, Balázs Illés, Réka Bátorfi, Karel Dusek
2014 J jnl
Modelling the self-alignment of passive chip components during reflow soldering.
Microelectron. Reliab.
Olivér Krammer
2013 J jnl
Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards.
IEEE Trans. Ind. Electron.
Csaba Benedek, Olivér Krammer, Mihály Janoczki, László Jakab
2012 J jnl
Modelling the effect of uneven PWB surface on stencil bending during stencil printing process.
Microelectron. Reliab.
Olivér Krammer, László Milán Molnár, László Jakab, András Szabó
2010 J jnl
Improved method for determining the shear strength of chip component solder joints.
Microelectron. Reliab.
Olivér Krammer, Bálint Sinkovics
2009 J jnl
Board level investigation of BGA solder joint deformation strength.
Microelectron. Reliab.
Bálint Sinkovics, Olivér Krammer