Norman Y. Zhou

14 papers Journal 11Unranked 3
YearRankTypeTitle / Venue / Authors
2022 — conf
A Novel 2T2R CR-based TCAM Design for High-speed and Energy-efficient Applications.
ACM Great Lakes Symposium on VLSI
Kangqiang Pan, Amr M. S. Tosson, Ningxuan Wang, Norman Y. Zhou, Lan Wei
2021 — conf
A Novel Programmable Variation-Tolerant RRAM-based Delay Element Circuit.
NANOARCH
Kangqiang Pan, Amr M. S. Tosson, Norman Y. Zhou, Lan Wei
2019 — conf
Batteryless Wireless Water Leak Detection System.
SmartNets
Oliver Witham, Levi Nathan Johnston, Ming Xiao, Jiayun Feng, Norman Y. Zhou, George Shaker
2013 J jnl
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.
Microelectron. Reliab.
Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon
2012 J jnl
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding.
Microelectron. Reliab.
Wan Ho Song, Michael Mayer, Norman Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon
2011 J jnl
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.
Microelectron. Reliab.
A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon
2011 J jnl
Influence of gold pick up on the hardness of copper free air ball.
Microelectron. Reliab.
Jae-sik Lee, Michael Mayer, Norman Y. Zhou, J. T. Moon, John Persic
2011 J jnl
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.
Microelectron. Reliab.
Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon
2011 J jnl
Role of process parameters on bondability and pad damage indicators in copper ball bonding.
Microelectron. Reliab.
I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Norman Y. Zhou
2011 J jnl
Silver pick up during tail formation in thermosonic wire bonding process.
Microelectron. Reliab.
Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong, J. T. Moon
2008 J jnl
Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings.
Microelectron. Reliab.
Young Woo Lee, Ki Ju Lee, Norman Y. Zhou, Jae Pil Jung
2008 J jnl
Erratum to "Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning": [Microelectronics Journal 38 (2007) 842-847].
Microelectron. J.
Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong
2008 J jnl
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
Microelectron. Reliab.
Chunjing Hang, Chunqing Wang, M. Mayer, Yanhong Tian, Norman Y. Zhou, Honghui Wang
2007 J jnl
Iterative optimization of tail breaking force of 1mil wire thermosonic ball bonding processes and the influence of plasma cleaning.
Microelectron. J.
Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong