| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | — | conf |
ASP-DAC
|
| 2025 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | C | conf |
VLSI-SoC
|
| 2025 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2025 | A | conf |
DATE
|
| 2024 | B | conf |
ASPDAC
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | — | conf |
VTC Spring
|
| 2023 | J | jnl |
ACM Trans. Reconfigurable Technol. Syst.
|
| 2023 | A* | conf |
AAAI
|
| 2023 | A* | conf |
DAC
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | — | conf |
ICCE-TW
|
| 2018 | J | jnl |
J. Comput. Sci. Technol.
|
| 2017 | J | jnl |
计算机科学
|
| 2014 | J | jnl |
Integr.
|
| 2013 | — | conf |
WWW (Companion Volume)
|
| 2013 | — | conf |
ASICON
|
| 2013 | — | conf |
ASICON
|
| 2013 | J | jnl |
J. Comput. Sci. Technol.
|
| 2011 | — | conf |
ASICON
|
| 2011 | — | conf |
ISPD
|
| 2011 | — | conf |
CAD/Graphics
|
| 2010 | — | conf |
ASP-DAC
|
| 2009 | — | conf |
ISVLSI
|
| 2009 | — | conf |
FSKD (4)
|