| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
MECO
|
| 2023 | — | conf |
MECO
|
| 2022 | — | conf |
MECO
|
| 2021 | J | jnl |
Sensors
|
| 2018 | J | jnl |
Microprocess. Microsystems
|
| 2017 | J | jnl |
Wirel. Pers. Commun.
|
| 2017 | — | conf |
TSP
|
| 2017 | J | jnl |
Wirel. Pers. Commun.
|
| 2016 | B | conf |
PIMRC
|
| 2015 | — | conf |
EUROCON
|
| 2014 | J | jnl |
Ann. des Télécommunications
|
| 2012 | — | conf |
EUSIPCO
|
| 2011 | Misc | conf |
ICASSP
|
| 2011 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2011 | — | conf |
MIPRO
|
| 2010 | J | jnl |
IEEE Trans. Image Process.
|
| 2010 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2010 | J | jnl |
Multim. Tools Appl.
|
| 2009 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2008 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2008 | J | jnl |
J. Electronic Imaging
|
| 2008 | J | jnl |
Ann. des Télécommunications
|