| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | A | conf |
DATE
|
| 2025 | A* | conf |
DAC
|
| 2024 | A | conf |
ICCAD
|
| 2024 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | A | conf |
ISLPED
|
| 2023 | — | conf |
NoCArc@MICRO
|
| 2023 | J | jnl |
IEEE Trans. Sustain. Comput.
|
| 2022 | J | jnl |
Ad Hoc Sens. Wirel. Networks
|
| 2022 | J | jnl |
J. Supercomput.
|
| 2022 | A* | conf |
DAC
|
| 2022 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2022 | J | jnl |
IEEE Open J. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | A* | conf |
ISCA
|
| 2021 | A | conf |
ISLPED
|
| 2021 | J | jnl |
J. Supercomput.
|
| 2021 | — | conf |
DFT
|
| 2020 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2019 | C | conf |
ICCD
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2018 | — | conf |
DASC/PiCom/DataCom/CyberSciTech
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | — | conf |
ESSDERC
|
| 2016 | Misc | conf |
EDCC
|
| 2015 | B | conf |
IM
|