| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | Misc | conf |
VTS
|
| 2024 | — | conf |
ISSCC
|
| 2024 | J | jnl |
Proc. IEEE
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | — | conf |
ISSCC
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | — | conf |
ISSCC
|
| 2021 | J | jnl |
IEEE Open J. Commun. Soc.
|
| 2020 | — | conf |
ISSCC
|
| 2019 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | — | conf |
ISSCC
|
| 2018 | J | jnl |
IEEE J. Solid State Circuits
|
| 2018 | — | conf |
SPCOM
|
| 2017 | — | conf |
ISSCC
|
| 2017 | J | jnl |
IEEE J. Solid State Circuits
|
| 2017 | J | jnl |
IEEE Commun. Mag.
|
| 2017 | A* | conf |
DAC
|
| 2016 | — | conf |
ISSCC
|
| 2016 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2016 | Misc | conf |
ACSSC
|
| 2016 | — | conf |
Full-duplex wireless: algorithms and rate improvement bounds for integrated circuit implementations.
HotWireless@MobiCom
|