Muhannad S. Bakir

35 papers A 1C 2Journal 7Unranked 25

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	A 32-Channel 85.4 dB SNDR Time-Multiplexed Neural Recording Front-End Achieving Within-Conversion Artifact Recovery. IEEE J. Solid State Circuits Arindam Mandal, Chi-Hsiang Huang, Julian Arenas, Wei-En Lee, Kevin Patino-Sosa, Philip Anschutz, Amanda L. Jacob, Keshav Ramachandra, Samuel J. Sober, Muhannad S. Bakir, Shaolan Li, Visvesh S. Sathe
2025	—	`conf`	A 32-Channel 85.4dB SNDR Time-multiplexed Neural Recording Frontend Achieving Within-Conversion Artifact Recovery. CICC Arindam Mandal, Chi-Hsiang Huang, Julian Arenas, Wei-En Lee, Philip Anschutz, Amanda L. Jacob, Keshav Ramachandra, Samuel J. Sober, Muhannad S. Bakir, Shaolan Li, Visvesh S. Sathe
2025	J	`jnl`	Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules. IEEE Trans. Very Large Scale Integr. Syst. Zihan Xia, Chihun Song, Ram Krishna, Ashita Victor, Srujan Penta, Muhannad S. Bakir, Elyse Rosenbaum, Nam Sung Kim, Mingu Kang
2024	—	`conf`	Co-Optimization for Robust Power Delivery Design in 3D-Heterogeneous Integration of Compute In-Memory Accelerators. VLSI Technology and Circuits Ankit Kaul, Madison Manley, James Read, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir
2023	J	`jnl`	H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention. IEEE Trans. Very Large Scale Integr. Syst. Wantong Li, Madison Manley, James Read, Ankit Kaul, Muhannad S. Bakir, Shimeng Yu
2022	J	`jnl`	A Compute-in-Memory Hardware Accelerator Design With Back-End-of-Line (BEOL) Transistor Based Reconfigurable Interconnect. IEEE J. Emerg. Sel. Topics Circuits Syst. Yandong Luo, Sourav Dutta, Ankit Kaul, Sung Kyu Lim, Muhannad S. Bakir, Suman Datta, Shimeng Yu
2022	—	`conf`	High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording. EMBC Jiaao Lu, Muneeb Zia, Matthew J. Williams, Amanda L. Jacob, Bryce Chung, Samuel J. Sober, Muhannad S. Bakir
2022	J	`jnl`	Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management. IEEE Access Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S. Bakir
2021	—	`conf`	Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. 3DIC Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir
2021	—	`conf`	Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. 3DIC Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir
2020	C	`conf`	A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration. VLSI-SOC Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury
2020	J	`jnl`	Design Space Exploration of Power Delivery For Advanced Packaging Technologies. CoRR Md Obaidul Hossen, Yang Zhang, Hesam Fathi Moghadam, Yue Zhang, Michael Dayringer, Muhannad S. Bakir
2020	—	`conf`	Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication. VLSI-SoC (Selected Papers) Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury
2019	—	`conf`	High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. 3DIC Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May
2018	—	`conf`	Towards a 1.1 mm CICC Pyungwoo Yeon, Muhannad S. Bakir, Maysam Ghovanloo
2017	—	`conf`	Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes. BioCAS Pyungwoo Yeon, Joe L. Gonzalez, Muneeb Zia, Sreejith Kochupurackal Rajan, Gary S. May, Muhannad S. Bakir, Maysam Ghovanloo
2017	C	`conf`	PhD forum: Heterogeneous interconnection of ICs using stitch-chips. VLSI-SoC Muhannad S. Bakir
2016	J	`jnl`	Chip-to-chip interconnect integration technologies. IEICE Electron. Express Muneeb Zia, Chaoqi Zhang, Hyun Suk Yang, Li Zheng, Muhannad S. Bakir
2016	—	`conf`	Design considerations for 2.5-D and 3-D integration accounting for thermal constraints. 3DIC Yang Zhang, Xuchen Zhang, William Wahby, Muhannad S. Bakir
2016	—	`conf`	The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. 3DIC William Wahby, Thomas E. Sarvey, Hardik Sharma, Hadi Esmaeilzadeh, Muhannad S. Bakir
2015	—	`conf`	Embedded cooling technologies for densely integrated electronic systems. CICC Thomas E. Sarvey, Yang Zhang, Li Zheng, Paragkumar Thadesar, Ravi Gutala, Colman Cheung, Arifur Rahman, Muhannad S. Bakir
2015	—	`conf`	Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. BioCAS Muneeb Zia, Chaoqi Zhang, Paragkumar Thadesar, Tracy Hookway, Taiyun Chi, Joe L. Gonzalez, Todd C. McDevitt, Hua Wang, Muhannad S. Bakir
2015	—	`conf`	Silicon interposer platform with low-loss through-silicon vias using air. 3DIC Hanju Oh, Gary S. May, Muhannad S. Bakir
2014	—	`conf`	Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. 3DIC Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir
2014	—	`conf`	Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. 3DIC Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir
2013	—	`conf`	Evaluation of 3DICs and fabrication of monolithic interlayer vias. 3DIC William Wahby, Ashish Dembla, Muhannad S. Bakir
2013	—	`conf`	Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs. 3DIC Yue Zhang, Hanju Oh, Muhannad S. Bakir
2012	—	`conf`	Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer. SoCC Li Zheng, Muhannad S. Bakir
2010	—	`conf`	Nanoelectronics in retrospect, prospect and principle. ISSCC James D. Meindl, Azad Naeemi, Muhannad S. Bakir, R. Murali
2009	A	`conf`	Co-design of signal, power, and thermal distribution networks for 3D ICs. DATE Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim
2008	—	`conf`	3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. CICC Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi, James D. Meindl
2007	—	`conf`	Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. CICC Muhannad S. Bakir, Bing Dang, James D. Meindl
2006	—	`conf`	Chip-level and Input/Output Interconnects for Gigascale SOCs: Limits and Opportunities. SoCC Azad Naeemi, Muhannad S. Bakir
2004	—	`conf`	Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution. SoCC Kaveh Shakeri, Muhannad S. Bakir, James D. Meindl
2002	—	`conf`	Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection. CICC Muhannad S. Bakir, Hollie A. Reed, Anthony V. Mulé, Paul A. Kohl, Kevin P. Martin, James D. Meindl