Mu Nie - RankMe

17 papers A* 1A 1Journal 14Unranked 1

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	A Novel Approach to Reducing Testing Costs and Minimizing Defect Escapes Using Dynamic Neighborhood Range and Shapley Values. ACM Trans. Design Autom. Electr. Syst. Tianming Ni, Wangsheng Rui, Cheng Zhuo, Yu Li, Xiaoqing Wen, Mu Nie
2026	J	`jnl`	Airs-Net: Adversarial-Improved Reversible Steganography Network for CT Images in the Internet of Medical Things and Telemedicine. IEEE J. Biomed. Health Informatics Kai Chen, Mu Nie, Jean-Louis Coatrieux, Yang Chen, Shipeng Xie
2026	J	`jnl`	LoongTrack: Exploring long-sequence modeling for visual tracking. Neural Networks Wenkang Zhang, Tianyang Xu, Fei Xie, Mu Nie, Wankou Yang
2025	J	`jnl`	A Response-Nonlinearized DEMUX-TDC PUF for Resistance Against Modeling Attacks and Secure Authentication Protocols. IEEE Trans. Very Large Scale Integr. Syst. Tianming Ni, Hao Wu, Mu Nie, Aibin Yan, Senling Wang, Xiaoqing Wen, Jingchang Bian
2025	J	`jnl`	A lightweight general PUF framework for resisting machine learning attacks. Integr. Tianming Ni, Fei Li, Zhengfeng Huang, Aibin Yan, Senling Wang, Xiaoqing Wen, Mu Nie, Jingchang Bian
2025	J	`jnl`	Authentication scheme resistant to machine learning based on obfuscation of multiple PUF responses. Microelectron. J. Tianming Ni, Hao Wu, Fei Li, Mu Nie, Yun Liu, Ang Hu, Jingchang Bian
2025	A	`conf`	Efficient Modulated State Space Model for Mixed-Type Wafer Defect Pattern Recognition. DATE Mu Nie, Shidong Zhu, Aibin Yan, Cheng Zhuo, Xiaoqing Wen, Tianming Ni
2025	J	`jnl`	Segmentation-Enhanced Overlapped Defect Identification for Multipatterns Wafer Maps. IEEE Trans. Instrum. Meas. Tianming Ni, Wen Jiang, Huaguo Liang, Xiaoqing Wen, Mu Nie
2024	J	`jnl`	A demultiplexer-based dual-path switching true random number generator. Microelectron. J. Tianming Ni, Kejie Xu, Hao Wu, Senling Wang, Mu Nie
2023	—	`conf`	Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning. ATS Mu Nie, Wen Jiang, Wankou Yang, Senling Wang, Xiaoqing Wen, Tianming Ni
2023	J	`jnl`	Enhancing motion visual cues for self-supervised video representation learning. Eng. Appl. Artif. Intell. Mu Nie, Zhibin Quan, Weiping Ding, Wankou Yang
2023	J	`jnl`	Multi-receptive field spatiotemporal network for action recognition. Int. J. Mach. Learn. Cybern. Mu Nie, Sen Yang, Zhenhua Wang, Baochang Zhang, Huimin Lu, Wankou Yang
2022	J	`jnl`	Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. IEEE Des. Test Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen
2021	A*	`conf`	TransPose: Keypoint Localization via Transformer. ICCV Sen Yang, Zhibin Quan, Mu Nie, Wankou Yang
2020	J	`jnl`	TransPose: Towards Explainable Human Pose Estimation by Transformer. CoRR Sen Yang, Zhibin Quan, Mu Nie, Wankou Yang
2017	J	`jnl`	A Region-Based Through-Silicon via Repair Method for Clustered Faults. IEICE Trans. Electron. Tianming Ni, Huaguo Liang, Mu Nie, Xiumin Xu, Aibin Yan, Zhengfeng Huang
2017	J	`jnl`	Vernier ring based pre-bond through silicon vias test in 3D ICs. IEICE Electron. Express Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen