Moritz Brunion

20 papers A 4C 1Journal 8Unranked 7
YearRankTypeTitle / Venue / Authors
2025 J jnl
Bandwidth-Latency-Thermal Co-Optimization of Interconnect-Dominated Many-Core 3D-IC.
IEEE Trans. Very Large Scale Integr. Syst.
Sudipta Das, Samuel Riedel, Mohamed Naeim, Moritz Brunion, Marco Bertuletti, Luca Benini, Julien Ryckaert, James Myers, Dwaipayan Biswas, Dragomir Milojevic
2025 J jnl
CMOS 2.0 - Redefining the Future of Scaling.
CoRR
Moritz Brunion, Navaneeth Kunhi Purayil, Francesco Dell'Atti, Sebastian Lam, Refik Bilgic, Mehdi B. Tahoori, Luca Benini, Julien Ryckaert
2025 A conf
Invited Paper: CMOS 2.0 - Redefining the Future of Scaling.
ICCAD
Moritz Brunion, Navaneeth Kunhi Purayil, Francesco Dell'Atti, Sebastian Lam, Refik Bilgic, Mehdi B. Tahoori, Luca Benini, Julien Ryckaert
2025 J jnl
Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes.
CoRR
Lorenzo Ruotolo, Lara Orlandic, Pengbo Yu, Moritz Brunion, Daniele Jahier Pagliari, Dwaipayan Biswas, Giovanni Ansaloni, David Atienza, Julien Ryckaert, Francky Catthoor, Yukai Chen
2024 C conf
3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs.
ISCAS
Sudipta Das, Samuel Riedel, Marco Bertuletti, Luca Benini, Moritz Brunion, Julien Ryckaert, James Myers, Dwaipayan Biswas, Dragomir Milojevic
2024 — conf
Backside Power Delivery in High Density and High Performance Context: IR-Drop and Block-Level Power-Performance-Area Benefits.
VLSI Technology and Circuits
Yun Zhou, S. C. Song, Halil Kükner, Giuliano Sisto, Sheng Yang, Anita Farokhnejad, Mohamed Naeim, Moritz Brunion, Ji-Yung Lin, Odysseas Zografos, Pieter Weckx, Shashank Ekbote, Nick Stevens-Yu, David Greenlaw, Steve Molloy, Geert Hellings, Julien Ryckaert
2024 J jnl
Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Nesara Eranna Bethur, Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim
2024 J jnl
On Legalization of Die Bonding Bumps and Pads for 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Yen-Hsiang Huang, Sai Pentapati, Anthony Agnesina, Moritz Brunion, Sung Kyu Lim
2024 — conf
Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies.
IRPS
Nitish Kumar, Sankatali Venkateswarlu, Yukai Chen, Moritz Brunion, Subrat Mishra, Ankur Gupta, Pushpapraj Singh, Francky Catthoor, James Myers, Julien Ryckaert, Dwaipayan Biswas
2024 — conf
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).
VLSI Technology and Circuits
S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert
2024 — conf
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.
IRPS
Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert
2023 — conf
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.
3DIC
Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic
2023 J jnl
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.
IEEE Trans. Very Large Scale Integr. Syst.
Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor
2023 — conf
On Legalization of Die Bonding Bumps and Pads for 3D ICs.
ISPD
Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim
2023 — conf
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
IRPS
Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert
2022 A conf
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs.
ISLPED
Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim
2022 A conf
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration.
DATE
Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini
2022 J jnl
Thermal Performance Analysis of Mempool RISC-V Multicore SoC.
IEEE Trans. Very Large Scale Integr. Syst.
Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor
2021 J jnl
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration.
CoRR
Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini
2021 A conf
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs.
ISLPED
Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto García Ortiz, Dragomir Milojevic, Francky Catthoor, Manu Perumkunnil, Sung Kyu Lim