Moongon Jung - RankMe

16 papers A* 3A 2Journal 5Unranked 6

Year	Rank	Type	Title / Venue / Authors
2017	J	`jnl`	Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning. IEEE Trans. Very Large Scale Integr. Syst. Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim
2015	J	`jnl`	Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
2014	A*	`conf`	On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim
2014	J	`jnl`	TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Commun. ACM Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
2013	—	`conf`	Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. ASP-DAC Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim
2013	J	`jnl`	Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Moongon Jung, David Z. Pan, Sung Kyu Lim
2013	—	`conf`	How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim
2013	A	`conf`	Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. ICCAD Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi
2012	—	`conf`	3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
2012	A*	`conf`	Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. DAC Moongon Jung, David Z. Pan, Sung Kyu Lim
2012	—	`conf`	Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang
2012	J	`jnl`	TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
2011	A	`conf`	Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim
2011	A*	`conf`	TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. DAC Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
2010	—	`conf`	A study of IR-drop noise issues in 3D ICs with through-silicon-vias. 3DIC Moongon Jung, Sung Kyu Lim
2010	—	`conf`	Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim