| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
ACM Trans. Model. Comput. Simul.
|
| 2024 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2024 | J | jnl |
J. Parallel Distributed Comput.
|
| 2024 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2024 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
SIGSIM-PADS
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
SIGSIM-PADS
|
| 2022 | — | conf |
ISPACS
|
| 2021 | — | conf |
IPDPS Workshops
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEICE Trans. Electron.
|
| 2021 | J | jnl |
J. Inf. Process. Syst.
|
| 2020 | — | conf |
SpringSim
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
J. Inf. Process. Syst.
|
| 2020 | — | conf |
SIGSIM-PADS
|
| 2020 | — | conf |
COOL CHIPS
|
| 2019 | — | conf |
ASP-DAC
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
An HLA-Based Formal Co-Simulation Approach for Rapid Prototyping of Heterogeneous Mixed-Signal SoCs.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2017 | — | conf |
CSA/CUTE
|
| 2016 | J | jnl |
Comput. Sci. Eng.
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2015 | J | jnl |
Int. J. Simul. Process. Model.
|
| 2014 | C | conf |
VLSI-SoC
|
| 2010 | C | conf |
DS-RT
|