Mohd Zulkifly Abdullah

28 papers Journal 27Unranked 1
YearRankTypeTitle / Venue / Authors
2021 J jnl
Design and Fabrication of a Dual Rotor-Embedded Wing Vertical Take-Off and Landing Unmanned Aerial Vehicle.
Unmanned Syst.
Seng Man Wong, Hann Woei Ho, Mohd Zulkifly Abdullah
2021 J jnl
Double-Layer Micro Porous Media Burner from Lean to Rich Fuel Mixture: Analysis of Entropy Generation and Exergy Efficiency.
Entropy
Nazmi Che Ismail, Mohd Zulkifly Abdullah, Khairil Faizi Mustafa, Nurul Musfirah Mazlan, Prem Gunnasegaran, Agustinus Purna Irawan
2020 J jnl
Entropy Generation and Exergy Analysis of Premixed Fuel-Air Combustion in Micro Porous Media Burner.
Entropy
Nazmi Che Ismail, Mohd Zulkifly Abdullah, Nurul Musfirah Mazlan, Khairil Faizi Mustafa
2018 J jnl
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Microelectron. Reliab.
Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah
2018 J jnl
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality.
Microelectron. Reliab.
Srivalli Chellvarajoo, Mohd Zulkifly Abdullah
2017 J jnl
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO
Microelectron. Reliab.
M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah
2017 J jnl
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.
Microelectron. Reliab.
Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali
2017 J jnl
Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board.
Microelectron. Reliab.
Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Azid, M. S. Abdul Aziz
2017 J jnl
Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink.
Microelectron. Reliab.
Shaker Farid Sufian, Mohd Zulkifly Abdullah
2017 J jnl
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering.
Microelectron. Reliab.
A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani
2016 J jnl
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.
Microelectron. Reliab.
Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz
2016 J jnl
Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem.
Comput. Math. Methods Medicine
Aizat Abas, Noorhafizah Hafizah Mokhtar, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Ang H. O. Tian
2016 J jnl
Lattice Boltzmann method study of bga bump arrangements on void formation.
Microelectron. Reliab.
Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor
2016 J jnl
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process.
Microelectron. Reliab.
Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas
2015 J jnl
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.
Simul. Model. Pract. Theory
M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid
2014 J jnl
Influence of solder bump arrangements on molded IC encapsulation.
Microelectron. Reliab.
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz
2014 J jnl
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review.
Microelectron. Reliab.
C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid
2014 J jnl
Thermal analysis of dual piezoelectric fans for cooling multi-LED packages.
Microelectron. Reliab.
Shaker Farid Sufian, Z. M. Fairuz, Mohammed Zubair, Mohd Zulkifly Abdullah, Julie Juliewatty Mohamed
2013 J jnl
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging.
Microelectron. Reliab.
C. Y. Khor, Mohd Zulkifly Abdullah
2013 J jnl
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process.
Microelectron. Reliab.
Ernest E. S. Ong, Mohd Zulkifly Abdullah, W. K. Loh, C. K. Ooi, R. Chan
2013 J jnl
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology.
Microelectron. Reliab.
W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor
2012 J jnl
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance.
Microelectron. Reliab.
W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor
2012 — conf
Design of DNA biosensors and amperometric microchips featuring copper electrodes.
BHI
Motasem H. Ghanim, Kamariah Hasan, Nazalan Najimudin, Mohd Zulkifly Abdullah
2012 J jnl
Investigation of the fluid/structure interaction phenomenon in IC packaging.
Microelectron. Reliab.
C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, Dadan Ramdan
2012 J jnl
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method.
Microelectron. Reliab.
Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani
2012 J jnl
Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology.
Simul. Model. Pract. Theory
C. Y. Khor, Mohd Zulkifly Abdullah
2010 J jnl
Design of an underwater glider platform for shallow-water applications.
Int. J. Intell. Def. Support Syst.
Nur Afande Ali Hussain, Ting Ming Chung, Mohd Rizal Arshad, Rosmiwati Mohd-Mokhtar, Mohd Zulkifly Abdullah
2010 J jnl
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process.
Microelectron. Reliab.
C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani