| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | A* | conf |
HPCA
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | A* | conf |
MICRO
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | A* | conf |
ISCA
|
| 2024 | A* | conf |
MICRO
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | — | conf |
ISVLSI
|
| 2023 | C | conf |
ISCAS
|
| 2023 | — | conf |
ISVLSI
|
| 2023 | J | jnl |
A High-Density and Reconfigurable SRAM-Based Digital Compute-In-Memory Macro for Low-Power AI Chips.
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | B | conf |
ICPADS
|
| 2023 | B | conf |
ICPADS
|
| 2023 | A* | conf |
MICRO
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2022 | — | conf |
ICTA
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|