| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Integr.
|
| 2026 | J | jnl |
J. Syst. Archit.
|
| 2026 | J | jnl |
Integr.
|
| 2025 | J | jnl |
Ecol. Informatics
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2025 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2025 | A | conf |
ICCAD
|
| 2025 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2025 | J | jnl |
IEEE Trans. Sustain. Comput.
|
| 2025 | Misc | conf |
FCCM
|
| 2025 | J | jnl |
Int. J. Sens. Networks
|
| 2025 | J | jnl |
J. Artif. Intell. Soft Comput. Res.
|
| 2025 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2024 | J | jnl |
PeerJ Comput. Sci.
|
| 2024 | J | jnl |
Ecol. Informatics
|
| 2024 | J | jnl |
Ecol. Informatics
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | — | conf |
PACRIM
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | — | conf |
TALE
|
| 2024 | J | jnl |
Ecol. Informatics
|
| 2024 | J | jnl |
Integr.
|
| 2024 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2023 | — | conf |
HCI (24)
|
| 2023 | A | conf |
DATE
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE ACM Trans. Comput. Biol. Bioinform.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | J | jnl |
Vina-GPU 2.0: Further Accelerating AutoDock Vina and Its Derivatives with Graphics Processing Units.
J. Chem. Inf. Model.
|
| 2022 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2022 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Int. J. Comput. Assist. Radiol. Surg.
|
| 2020 | A* | conf |
DAC
|
| 2020 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
J. Syst. Archit.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | A | conf |
DATE
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | A* | conf |
DAC
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | B | conf |
ICPADS
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
PACRIM
|
| 2019 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2019 | J | jnl |
Mach. Vis. Appl.
|
| 2019 | — | conf |
PACRIM
|
| 2019 | J | jnl |
CoRR
|
| 2019 | B | conf |
ISPASS
|
| 2019 | J | jnl |
Microprocess. Microsystems
|
| 2019 | J | jnl |
Lowering the Hit Latencies of Low Voltage Caches Based on the Cross-Sensing Timing Speculation SRAM.
IEEE Access
|
| 2019 | — | conf |
MEMSYS
|
| 2019 | J | jnl |
CoRR
|
| 2018 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2018 | J | jnl |
J. Syst. Archit.
|
| 2017 | — | conf |
PACRIM
|
| 2017 | — | conf |
PACRIM
|
| 2017 | A | conf |
DATE
|
| 2017 | J | jnl |
Microprocess. Microsystems
|
| 2017 | J | jnl |
Microprocess. Microsystems
|
| 2013 | — | conf |
ASICON
|
| 2012 | J | jnl |
IEICE Trans. Inf. Syst.
|