Ming-Yi Tsai

16 papers A 1C 1Journal 12Unranked 2
YearRankTypeTitle / Venue / Authors
2022 J jnl
A Novel Approach to Automate IoT Testing of Gateways and Devices.
J. Inf. Sci. Eng.
Chien-Hung Liu, Wen-Yew Liang, Ming-Yi Tsai, Wei-Che Chang, Woei-Kae Chen
2019 J jnl
Ultrasonic-Assisted Innovative Polyurethane Tool to Polish Mold Steel.
Int. J. Autom. Technol.
Ming-Yi Tsai, Yue-Feng Lin, Jihng-Kuo Ho, Jing-Guang Yang
2018 C conf
ICAT: An IoT Device Compatibility Testing Tool.
APSEC
Woei-Kae Chen, Chien-Hung Liu, William W.-Y. Liang, Ming-Yi Tsai
2016 J jnl
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.
Microelectron. Reliab.
Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu
2016 J jnl
Investigation of milling cutting forces and cutting coefficient for aluminum 6060-T6.
Comput. Electr. Eng.
Ming-Yi Tsai, Sheng-Yen Chang, Jui-Pin Hung, Cheng-Chi Wang
2015 J jnl
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.
Microelectron. Reliab.
Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu
2015 — conf
Towards an air pollution health study data management system - A case study from a smoky Swiss railway.
EnviroInfo/ICT4S (2)
Evangelia Papoutsoglou, Argyrios Samourkasidis, Ming-Yi Tsai, Mark Davey, Alex Ineichen, Marloes Eeftens, Ioannis N. Athanasiadis
2014 J jnl
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages.
Microelectron. Reliab.
Ming-Yi Tsai, P. S. Huang, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, J. P. Lin
2012 J jnl
Strength determination of high-power LED die using point-load and line-load tests.
Microelectron. Reliab.
C. H. Chen, Ming-Yi Tsai
2012 J jnl
Thermal measurements and analyses of low-cost high-power LED packages and their modules.
Microelectron. Reliab.
Ming-Yi Tsai, C. H. Chen, C. S. Kang
2011 J jnl
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes.
Microelectron. Reliab.
Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai
2010 J jnl
Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps.
Microelectron. Reliab.
Cheng-Chen Lin, Liann-Be Chang, Ming-Jer Jeng, Chia-Yi Yen, Atanu Das, Chung-Yi Tang, Ming-Yi Tsai, Mu-Jen Lai
2008 J jnl
Evaluation of test methods for silicon die strength.
Microelectron. Reliab.
Ming-Yi Tsai, C. H. Chen
2006 J jnl
Thermal deformation measurements and predictions of MAP-BGA electronic packages.
Microelectron. Reliab.
Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu
2001 A conf
Pronunciation variation analysis with respect to various linguistic levels and contextual conditions for Mandarin Chinese.
INTERSPEECH
Ming-Yi Tsai, Fu-Chiang Chou, Lin-Shan Lee
1999 — conf
Phonetic state tied-mixture tone modeling for large vocabulary continuous Mandarin speech recognition.
EUROSPEECH
Tai-Hsuan Ho, Chin-Jung Liu, Herman Sun, Ming-Yi Tsai, Lin-Shan Lee