Min Miao

20 papers Journal 10Unranked 10
YearRankTypeTitle / Venue / Authors
2024 J jnl
L-ENet: An Ultralightweight SAR Image Detection Network.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
Yutong Wang, Min Miao, Shiliang Zhu
2024 J jnl
SCNet: A Lightweight and Efficient Object Detection Network for Remote Sensing.
IEEE Geosci. Remote. Sens. Lett.
Shiliang Zhu, Min Miao
2023 J jnl
A PAM4 transceiver design scheme with threshold adaptive and tap adaptive.
EURASIP J. Adv. Signal Process.
Xuena Liu, Zhensong Li, Hao Wen, Min Miao, Yuduo Wang, Zhuwei Wang
2023 J jnl
A physics-based modeling method of THz Schottky diode for circuit simulation.
Microelectron. J.
Weiheng Zhao, Yudi Zhao, Min Miao
2022 J jnl
A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging.
Microelectron. J.
Min Miao, Danya Zhang, Xin Nie, Jingpeng Bu
2022 — conf
Design of 20Gb/s PAM4 Transmitter with 2-tap FFE.
CISP-BMEI
Xuena Liu, Zhensong Li, Hao Wen, Min Miao
2022 — conf
TSV Defects Classification with Machine Learning Approaches.
ICTA
Haitao He, Changhao Luo, Junchen Dong, Yudi Zhao, Min Miao, Kai Zhao
2021 — conf
Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer.
ICTA
Zhuanzhuan Zhang, Min Miao, Xiaolong Duan
2021 J jnl
Design of EMI and suppression structure based on bar-via.
Microelectron. J.
Na Li, Min Miao
2020 J jnl
Parallel Coding Scheme With Turbo Product Code for Mobile Multimedia Transmission in MIMO-FBMC System.
IEEE Access
Zhensong Li, Min Miao, Zhuwei Wang
2018 — conf
On Continuous Speech Recognition of Indian English.
ACAI
Xin Jin, Keliang Zhang, Xian Huang, Min Miao
2018 J jnl
Onboard Spectral and Spatial Cloud Detection for Hyperspectral Remote Sensing Images.
Remote. Sens.
Haoyang Li, Hong Zheng, Chuanzhao Han, Haibo Wang, Min Miao
2017 J jnl
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias.
IEEE Trans. Very Large Scale Integr. Syst.
Xiaole Cui, Xiaoxin Cui, Yewen Ni, Min Miao, Yufeng Jin
2013 J jnl
Electrical characterization of integrated passive devices using thin film technology for 3D integration.
J. Zhejiang Univ. Sci. C
Xin Sun, Yunhui Zhu, Zhen Hua Liu, Qing-hu Cui, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin
2013 — conf
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.
NEMS
Yichao Xu, Guanjiang Wang, Xin Sun, Runiu Fang, Min Miao, Yufeng Jin
2013 — conf
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.
NEMS
Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin
2012 — conf
A 3D micro-channel cooling system embedded in LTCC packaging substrate.
NEMS
Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin
2011 — conf
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate.
NEMS
Hua Gan, Yufeng Jin, Min Miao, Xin Sun
2010 — conf
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge.
NEMS
Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan
2009 — conf
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.
NEMS
Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo