Michele Stucchi

36 papers A 4B 2C 1Journal 10Unranked 19

Year	Rank	Type	Title / Venue / Authors
2025	—	`conf`	Impact of Al-doping on Al: HfO2Dielectric Reliability in MIM Capacitors. IRPS C. Fohn, F. Zharfan, Emmanuel Chery, Kris Croes, Michele Stucchi, V. Afanas'ev
2024	—	`conf`	Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias. VLSI Technology and Circuits P. Zhao, Liesbeth Witters, Anne Jourdain, Michele Stucchi, Nicolas Jourdan, J. W. Maes, H. Bana, C. Zhu, R. Chukka, F. Sebaai, Kevin Vandersmissen, N. Heylen, D. Montero, S. Wang, K. D'Have, F. Schleicher, J. De Vos, Gerald Beyer, A. Miller, Eric Beyne
2023	—	`conf`	Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node. VLSI Technology and Circuits Giuliano Sisto, R. Preston, Rongmei Chen, Gioele Mirabelli, Anita Farokhnejad, Yun Zhou, Ivan Ciofi, Anne Jourdain, A. Veloso, Michele Stucchi, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert
2023	B	`conf`	Study of Transistor Metrics for Room-Temperature Screening of Single Electron Transistors for Silicon Spin Qubit Applications. ETS Francesco Lorenzelli, Asser Elsayed, Clement Godfrin, Alexander Grill, Stefan Kubicek, Ruoyu Li, Michele Stucchi, Danny Wan, Kristiaan De Greve, Erik Jan Marinissen, Georges G. E. Gielen
2023	A	`conf`	Wafer-Scale Electrical Characterization of Silicon Quantum Dots from Room to Low Temperatures. ITC Francesco Lorenzelli, Asser Elsayed, Clement Godfrin, Alexander Grill, Stefan Kubicek, Ruoyu Li, Michele Stucchi, Danny Wan, Kristiaan De Greve, Erik Jan Marinissen, Georges G. E. Gielen
2022	—	`conf`	Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node. VLSI Technology and Circuits Rongmei Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, Anabela Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne
2022	—	`conf`	Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails. VLSI Technology and Circuits Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, Filip Schleicher, F. Sebaai, Yusuke Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, Naoto Horiguchi
2021	J	`jnl`	Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy. IEEE Trans. Instrum. Meas. Kristof J. P. Jacobs, Michele Stucchi, Eric Beyne
2020	B	`conf`	Accurate Measurements of Small Resistances in Vertical Interconnects with Small Aspect Ratios. ETS Michele Stucchi, Ferenc Fodor, Erik Jan Marinissen
2020	—	`conf`	Metal reliability mechanisms in Ruthenium interconnects. IRPS Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes
2019	—	`conf`	Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. IRPS Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox
2018	A	`conf`	Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits. ITC Erik Jan Marinissen, Ferenc Fodor, Arnita Podpod, Michele Stucchi, Yu-Rong Jian, Cheng-Wen Wu
2018	—	`conf`	TSV process-induced MOS reliability degradation. IRPS Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes
2017	J	`jnl`	Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. Microelectron. Reliab. Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne
2016	—	`conf`	Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. 3DIC Stefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu
2016	J	`jnl`	Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne
2015	A	`conf`	Impact of interconnect multiple-patterning variability on SRAMs. DATE Ioannis Karageorgos, Michele Stucchi, Praveen Raghavan, Julien Ryckaert, Zsolt Tokei, Diederik Verkest, Rogier Baert, Sushil Sakhare, Wim Dehaene
2014	J	`jnl`	Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes
2012	J	`jnl`	Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique. IEEE Trans. Instrum. Meas. Michele Stucchi, Dimitrios Velenis, Guruprasad Katti
2011	J	`jnl`	Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
2011	J	`jnl`	Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectron. J. Herman Oprins, Adi Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng
2010	C	`conf`	3D integration: Circuit design, test, and reliability challenges. IOLTS Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal
2010	—	`conf`	Design issues and considerations for low-cost 3D TSV IC technology. ISSCC Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
2010	—	`conf`	Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
2009	J	`jnl`	3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot. Proc. IEEE Paul Marchal, Bruno Bougard, Guruprasad Katti, Michele Stucchi, Wim Dehaene, Antonis Papanikolaou, Diederik Verkest, Bart Swinnen, Eric Beyne
2009	—	`conf`	3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen
2009	—	`conf`	Impact of 3D design choices on manufacturing cost. 3DIC Dimitrios Velenis, Michele Stucchi, Erik Jan Marinissen, Bart Swinnen, Eric Beyne
2008	—	`conf`	A tool flow for predicting system level timing failures due to interconnect reliability degradation. ACM Great Lakes Symposium on VLSI Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor
2006	—	`conf`	Impact of interconnect resistance increase on system performance of low power and high performance designs. SLIP Mandeep Bamal, Youssef Travaly, Wenqi Zhang, Michele Stucchi, Karen Maex
2006	J	`jnl`	Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies. IEEE J. Solid State Circuits Evelyn Grossar, Michele Stucchi, Karen Maex, Wim Dehaene
2006	—	`conf`	Statistically Aware SRAM Memory Array Design. ISQED Evelyn Grossar, Michele Stucchi, Karen Maex, Wim Dehaene
2004	—	`conf`	Interconnect width selection for deep submicron designs using the table lookup method. SLIP Mandeep Bamal, Evelyn Grossar, Michele Stucchi, Karen Maex
2003	—	`conf`	Global interconnect trade-off for technology over memory modules to application level: case study. SLIP Antonis Papanikolaou, Miguel Miranda, Francky Catthoor, Henk Corporaal, Hugo De Man, David De Roest, Michele Stucchi, Karen Maex
2002	J	`jnl`	Frequency dependence in interline capacitance measurements. IEEE Trans. Instrum. Meas. Michele Stucchi, Karen Maex
2002	—	`conf`	Interconnect exploration for future wire dominated technologies. SLIP Antonis Papanikolaou, Miguel Miranda, Francky Catthoor, Henk Corporaal, Hugo De Man, David De Roest, Michele Stucchi, Karen Maex
2002	A	`conf`	Simple and Efficient Approach for Shunt Admittance Parameters Calculations of VLSI On-Chip Interconnects on Semiconducting Substrate. DATE Hasan Ymeri, Bart Nauwelaers, Karen Maex, David De Roest, Michele Stucchi, Servaas Vandenberghe