Miao Meng

20 papers C 1Misc 1Journal 7Unranked 11
YearRankTypeTitle / Venue / Authors
2026 J jnl
A Low-Power Backscatter System With a Digitally Controlled Reconfigurable 16-QAM Modulator for Energy-Efficient Wireless Communication.
IEEE J. Solid State Circuits
Yongling Zhang, Ji Xiong, Miao Meng
2025 J jnl
A Battery-Free BLE Backscatter Communication Chip for Wearable Systems.
IEEE Solid State Circuits Lett.
Yongling Zhang, Ji Xiong, Junzai Chen, Xiaoyu Li, Jinrui Zuo, Yan Wang, Xiaoyi Wang, Miao Meng
2025 — conf
A Wearable Backscatter System Featuring Concurrent RF Harvesting and Bidirectional Communication with Commodity BLE Transceivers.
CICC
Ji Xiong, Yongling Zhang, Junzai Chen, Xiaoyu Li, Jinrui Zuo, Yan Wang, Xiaoyi Wang, Miao Meng
2025 — conf
An Implantable Fully-Packaged Current-Controlled Wireless Near-Adiabatic Neural Stimulator Achieving 71.7% Peak Efficiency and 13.5% Efficiency Variation Across Supported Stimulation Current Range.
CICC
Hong Liao, Wentao Ma, Xiaoxu Yang, Jianfang Nie, Bingfang Wang, Zhiqiang Chang, Yin Fang, Miao Meng
2024 — conf
12.4 A 19μW 200Mb/s loT Tag Demonstrating High-Definition Video Streaming via a Digital-Switch-Based Reconfigurable 16-QAM Backscatter Communication Technique.
ISSCC
Yongling Zhang, Rongliang Luo, Ji Xiong, Siqi Liang, Miao Meng
2024 — conf
A 45μW Ultrasonic Implantable Wireless Neural Recording Chip Featuring Simultaneous Power Transmission and Backscatter Communication.
BioCAS
Xiaoxu Yang, Yongling Zhang, Wentao Ma, Dahai Yao, Tianle Tang, Miao Meng
2024 — conf
A Fully On-chip 0.04mm
BioCAS
Wentao Ma, Miao Meng
2023 J jnl
A Fully-Reflective Wi-Fi-Compatible Backscatter Communication System With Retro-Reflective MIMO Gain for Improved Range.
IEEE J. Solid State Circuits
Miao Meng, Manideep Dunna, Shihkai Kuo, Hans Chinghan Yu, Po-Han Peter Wang, Dinesh Bharadia, Patrick P. Mercier
2021 — conf
12.2 Improving the Range of WiFi Backscatter Via a Passive Retro-Reflective Single-Side-Band-Modulating MIMO Array and Non-Absorbing Termination.
ISSCC
Miao Meng, Manideep Dunna, Hans Chinghan Yu, Shihkai Kuo, Po-Han Peter Wang, Dinesh Bharadia, Patrick P. Mercier
2021 Misc conf
SyncScatter: Enabling WiFi like synchronization and range for WiFi backscatter Communication.
NSDI
Manideep Dunna, Miao Meng, Po-Han Wang, Chi Zhang, Patrick P. Mercier, Dinesh Bharadia
2019 J jnl
A Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE Mode Piezoelectric Energy Harvesting Interface Circuit.
IEEE Trans. Biomed. Circuits Syst.
Miao Meng, Dixiong Wang, Binh Duc Truong, Susan Trolier-McKinstry, Shad Roundy, Mehdi Kiani
2019 — conf
An Ultrasonically Powered Wireless System for In Vivo Gastric Slow-Wave Recording.
EMBC
Miao Meng, Philip Graybill, Raddy L. Ramos, Amir Javan-Khoshkholgh, Aydin Farajidavar, Mehdi Kiani
2019 J jnl
Gastric Seed: Toward Distributed Ultrasonically Interrogated Millimeter-Sized Implants for Large-Scale Gastric Electrical-Wave Recording.
IEEE Trans. Circuits Syst. II Express Briefs
Miao Meng, Mehdi Kiani
2019 — conf
Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE-Mode Piezoelectric Energy Harvesting of Multi-Axial Human Motion.
ISSCC
Miao Meng, Ahmed Ibrahim, Tiancheng Xue, Hong Goo Yeo, Dixiong Wang, Shad Roundy, Susan Trolier-McKinstry, Mehdi Kiani
2019 — conf
Self-Image-Guided Ultrasonic Wireless Power Transmission to Millimeter-Sized Biomedical Implants.
EMBC
Miao Meng, Mehdi Kiani
2017 J jnl
A Hybrid Inductive-Ultrasonic Link for Wireless Power Transmission to Millimeter-Sized Biomedical Implants.
IEEE Trans. Circuits Syst. II Express Briefs
Miao Meng, Mehdi Kiani
2017 J jnl
Design and Optimization of Ultrasonic Wireless Power Transmission Links for Millimeter-Sized Biomedical Implants.
IEEE Trans. Biomed. Circuits Syst.
Miao Meng, Mehdi Kiani
2017 C conf
Inductive and ultrasonic wireless power transmission to biomedical implants.
ISCAS
Ahmed Ibrahim, Miao Meng, Mehdi Kiani
2016 — conf
Optimal resonance configuration for ultrasonic wireless power transmission to millimeter-sized biomedical implants.
EMBC
Miao Meng, Mehdi Kiani
2015 — conf
Design considerations for ultrasonic power transmission to millimeter-sized implantable microelectronics devices.
BioCAS
Miao Meng, Ahmed Ibrahim, Mehdi Kiani