| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Microelectron. J.
|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2026 | J | jnl |
IEICE Trans. Commun.
|
| 2025 | J | jnl |
IEEE Trans. Knowl. Data Eng.
|
| 2025 | J | jnl |
Comput. Electr. Eng.
|
| 2025 | A | conf |
ICPC
|
| 2025 | J | jnl |
Biomed. Signal Process. Control.
|
| 2025 | — | conf |
HCI (17)
|
| 2025 | — | conf |
ICMLT
|
| 2025 | — | conf |
ADMA (1)
|
| 2025 | — | conf |
JCDL
|
| 2025 | C | conf |
DATA
|
| 2025 | J | jnl |
Complex Intell. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
JCDL
|
| 2025 | — | conf |
ADMA (3)
|
| 2025 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2025 | J | jnl |
Data Intell.
|
| 2025 | B | conf |
TrustCom
|
| 2024 | J | jnl |
Comput. Electr. Eng.
|
| 2024 | — | conf |
JCDL
|
| 2024 | J | jnl |
J. Data Inf. Sci.
|
| 2024 | J | jnl |
PeerJ Comput. Sci.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | — | conf |
HCI (4)
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | — | conf |
HCI (60)
|
| 2023 | J | jnl |
Environ. Model. Softw.
|
| 2023 | J | jnl |
Virtual Real. Intell. Hardw.
|
| 2023 | J | jnl |
Expert Syst. Appl.
|
| 2023 | C | conf |
IECON
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | C | conf |
IECON
|
| 2023 | J | jnl |
Int. J. Prod. Res.
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2021 | J | jnl |
Concurr. Eng. Res. Appl.
|
| 2020 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2020 | J | jnl |
J. Intell. Fuzzy Syst.
|
| 2018 | — | conf |
WCSP
|
| 2016 | J | jnl |
J. Intell. Fuzzy Syst.
|
| 2015 | — | conf |
HCI (1)
|