| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | — | conf |
ASCC
|
| 2024 | C | conf |
INDIN
|
| 2023 | J | jnl |
J. Electronic Imaging
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Neural Process. Lett.
|
| 2022 | — | book |
|
| 2021 | — | conf |
ICSE (Companion Volume)
|
| 2021 | A* | conf |
ICSE
|
| 2021 | — | conf |
ICC
|
| 2020 | — | conf |
MMM (2)
|
| 2020 | B | conf |
GLOBECOM
|
| 2020 | J | jnl |
IEEE Trans. Commun.
|
| 2020 | J | jnl |
IEEE Internet Things J.
|
| 2020 | J | jnl |
IET Image Process.
|
| 2020 | — | conf |
VTC Fall
|
| 2020 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2020 | J | jnl |
Pattern Recognit. Lett.
|
| 2019 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2019 | B | conf |
GLOBECOM
|
| 2019 | J | jnl |
IEEE Internet Things J.
|
| 2018 | — | conf |
ICC
|
| 2017 | — | conf |
ICC
|
| 2017 | — | conf |
VTC Fall
|
| 2016 | B | conf |
GLOBECOM
|