| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ASPLOS (2)
|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2025 | J | jnl |
IEEE Trans. Computers
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | C | conf |
ICCD
|
| 2023 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2023 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
ACM Trans. Storage
|
| 2022 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | Misc | conf |
CASES
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | A | conf |
DATE
|
| 2021 | J | jnl |
J. Comput. Sci. Technol.
|
| 2020 | A | conf |
DATE
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | A* | conf |
Adapting Layer RBERs Variations of 3D Flash Memories via Multi-granularity Progressive LDPC Reading.
DAC
|
| 2019 | A | conf |
DATE
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | Misc | conf |
SAC
|
| 2019 | C | conf |
ICCD
|
| 2018 | J | jnl |
IEEE Access
|
| 2017 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2017 | C | conf |
ICCD
|
| 2017 | — | conf |
NVMSA
|
| 2017 | A | conf |
DATE
|
| 2017 | A | conf |
DATE
|
| 2016 | Misc | conf |
MSST
|
| 2015 | — | conf |
NAS
|