| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | Misc | conf |
SenSys
|
| 2025 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2025 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2024 | J | jnl |
IEEE Trans. Control. Syst. Technol.
|
| 2024 | C | conf |
IECON
|
| 2024 | C | conf |
IECON
|
| 2024 | J | jnl |
CoRR
|
| 2024 | C | conf |
IECON
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | A* | conf |
MobiCom
|
| 2023 | — | conf |
e-Energy
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
CoRR
|
| 2022 | Misc | conf |
SenSys
|
| 2022 | — | conf |
IASA@MobiSys
|
| 2022 | — | conf |
BuildSys
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | C | conf |
IECON
|
| 2022 | C | conf |
IECON
|
| 2021 | C | conf |
A Balanced and Vertically Stacked Multilevel Power Converter Topology with Linear Component Scaling.
IECON
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | J | jnl |
Pervasive Mob. Comput.
|
| 2020 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2019 | — | conf |
SII
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2019 | C | conf |
IECON
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | C | conf |
IECON
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | C | conf |
IECON
|
| 2017 | C | conf |
IECON
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | — | conf |
ICIT
|
| 2016 | C | conf |
IECON
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2013 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2013 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2013 | — | conf |
ECC
|
| 2011 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2011 | J | jnl |
IEEE Trans. Ind. Electron.
|