| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | A | conf |
RecSys
|
| 2024 | A | conf |
RecSys
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
JSIAM Lett.
|
| 2024 | J | jnl |
J. Chem. Inf. Model.
|
| 2023 | J | jnl |
Math. Struct. Comput. Sci.
|
| 2023 | J | jnl |
IEICE Trans. Commun.
|
| 2023 | — | conf |
SII
|
| 2023 | J | jnl |
J. Robotics Mechatronics
|
| 2023 | B | conf |
SMC
|
| 2022 | — | conf |
OECC/PSC
|
| 2021 | A* | conf |
ICML
|
| 2021 | — | conf |
ECIR (1)
|
| 2021 | — | conf |
L2D@WSDM
|
| 2021 | Misc | conf |
SAC
|
| 2021 | — | conf |
ICDE Workshops
|
| 2021 | A | conf |
RecSys
|
| 2021 | J | jnl |
CoRR
|
| 2021 | — | conf |
Pneumatic Concave Deformable Device and Finger Deformation-Based Evaluation for Hardness Perception.
WHC
|
| 2020 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | — | conf |
UIST (Adjunct Volume)
|
| 2020 | Misc | conf |
SAC
|
| 2020 | A | conf |
UAI
|
| 2020 | J | jnl |
CoRR
|
| 2020 | A | conf |
RecSys
|
| 2020 | J | jnl |
CoRR
|
| 2019 | — | conf |
ICDM Workshops
|
| 2019 | — | conf |
OECC/PSC
|
| 2019 | A* | conf |
WWW
|
| 2019 | J | jnl |
J. Inf. Process.
|
| 2019 | A | conf |
RecSys
|
| 2019 | — | conf |
CinC
|
| 2018 | A | conf |
IUI
|
| 2017 | — | conf |
RecTemp@RecSys
|
| 2017 | J | jnl |
CoRR
|
| 2016 | J | jnl |
J. Inf. Process.
|
| 2016 | J | jnl |
IxD&A
|
| 2016 | A | conf |
UMAP
|
| 2015 | — | conf |
EMPIRE@RecSys
|
| 2014 | J | jnl |
CoRR
|
| 2014 | — | conf |
ICCA
|
| 2011 | — | conf |
ROBIO
|
| 2010 | — | conf |
ISSCC
|
| 2006 | C | conf |
IAS
|