Martin Kraft - RankMe

11 papers B 1Journal 3Unranked 7

Year	Rank	Type	Title / Venue / Authors
2026	—	`conf`	Outline of a technical solution for remote barn climate monitoring. GIL Andrii Besieda, Martin Kraft, Anne-Kathrin Schwab, Jantje Halberstadt, Christina Umstätter
2024	—	`conf`	The FAIR-Device - an AI image recognition-based non-lethal and generalist monitoring system for insect biodiversity in agriculture. GIL Juan A. Chiavassa, Martin Kraft, Patrick Noack, Simon Walther, Ameli Kirse, Christoph Scherber
2022	—	`conf`	Digitalisierung und Innovation in der Landwirtschaft. GI-Jahrestagung Jantje Halberstadt, Arne Ortland, Anne-Kathrin Schwab, Andrii Besieda, Martin Kraft
2022	—	`conf`	Organizational aspects of digitalization in the context of agriculture: Exemplary results from analyzing data flows in German dairy farming. CENTERIS/ProjMAN/HCist Anne-Kathrin Schwab, Jantje Halberstadt, Andrii Besieda, Martin Kraft, Arne Ortland
2020	J	`jnl`	A Comparison of Different Counting Methods for a Holographic Particle Counter: Designs, Validations and Results. Sensors Georg Brunnhofer, Isabella Hinterleitner, Alexander Bergmann, Martin Kraft
2020	—	`conf`	Virtual Sensing of Temperatures in Indoor Environments: A Case Study. ICDM (Workshops) Andrea Brunello, Martin Kraft, Angelo Montanari, Federico Pittino, Andrea Urgolo
2019	J	`jnl`	Characterization of a Robust 3D- and Inkjet-Printed Capacitive Position Sensor for a Spectrometer Application. Sensors Lisa-Marie Faller, Martin Lenzhofer, Christina Hirschl, Martin Kraft, Hubert Zangl
2019	J	`jnl`	Design and Validation of a Holographic Particle Counter. Sensors Georg Brunnhofer, Alexander Bergmann, Andreas Klug, Martin Kraft
2017	B	`conf`	How to teach your robot in 5 minutes: Applying UX paradigms to human-robot-interaction. RO-MAN Martin Kraft, Markus Rickert
2016	—	`conf`	Direct optical stress sensing in semiconductor manufacturing using Raman micro-spectrometry. IEEE SENSORS Martin De Biasio, Martin Kraft, Michael Roesner, Christoph Bergmann, Maria Mercedes Cerezuela-Barreto, Dirk Lewke, Martin Schellenberger
2016	—	`conf`	Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation. IEEE SENSORS Thomas Arnold, Johannes Schicker, Martin Kraft, Christina Hirschl