| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | Misc | conf |
SoftCOM
|
| 2025 | Misc | conf |
SoftCOM
|
| 2024 | Misc | conf |
SoftCOM
|
| 2024 | Misc | conf |
SoftCOM
|
| 2024 | Misc | conf |
SoftCOM
|
| 2023 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2023 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2023 | Misc | conf |
SoftCOM
|
| 2023 | Misc | conf |
SoftCOM
|
| 2023 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2023 | Misc | conf |
SoftCOM
|
| 2022 | C | conf |
IPAS
|
| 2022 | Misc | conf |
SoftCOM
|
| 2022 | Misc | conf |
SoftCOM
|
| 2021 | — | conf |
ICCE-Berlin
|
| 2021 | J | jnl |
IEEE Trans. Learn. Technol.
|
| 2021 | J | jnl |
J. Real Time Image Process.
|
| 2020 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2020 | — | conf |
MIPRO
|
| 2020 | J | jnl |
J. Real Time Image Process.
|
| 2020 | J | jnl |
J. Real Time Image Process.
|
| 2020 | — | conf |
ICCE-Berlin
|
| 2020 | — | conf |
ICCE-Berlin
|
| 2019 | — | conf |
IWSSIP
|
| 2019 | — | conf |
MIPRO
|
| 2019 | J | jnl |
Signal Process. Image Commun.
|
| 2019 | J | jnl |
Multim. Tools Appl.
|
| 2018 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2018 | — | conf |
ICCE-Berlin
|
| 2018 | J | jnl |
Adv. Eng. Informatics
|
| 2018 | J | jnl |
Multim. Tools Appl.
|
| 2018 | C | conf |
EDUCON
|
| 2017 | — | conf |
ICCE-Berlin
|
| 2017 | — | conf |
ICCE-Berlin
|
| 2015 | J | jnl |
Wirel. Pers. Commun.
|
| 2013 | J | jnl |
Signal Process. Image Commun.
|
| 2010 | J | jnl |
Multim. Tools Appl.
|