Mario Gonzalez

20 papers Journal 10Unranked 10
YearRankTypeTitle / Venue / Authors
2022 — conf
Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress.
IRPS
Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf
2021 — conf
Impact of mechanical strain on wakeup of HfO2 ferroelectric memory.
IRPS
Anastasiia Kruv, Sean R. C. McMitchell, Sergiu Clima, Oguzhan O. Okudur, Nicolo Ronchi, Geert Van den Bosch, Mario Gonzalez, Ingrid De Wolf, Jan Van Houdt
2020 — conf
On the impact of mechanical stress on gate oxide trapping.
IRPS
Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Goes, Tibor Grasser, Ingrid De Wolf
2019 — conf
Impact of Mechanical Stress on the Electrical Performance of 3D NAND.
IRPS
Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf, Arnaud Furnémont
2018 J jnl
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly.
Microelectron. Reliab.
Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne
2018 — conf
Stress mitigation of 3D-stacking/packaging induced stresses.
IRPS
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne
2017 J jnl
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.
Microelectron. Reliab.
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei
2017 J jnl
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices.
Microelectron. Reliab.
Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne
2016 J jnl
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.
Microelectron. Reliab.
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
2016 J jnl
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.
Microelectron. Reliab.
Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
2016 — conf
Managing Quality of Service in Wireless Body Area Networks using CoAP.
EIT
Ehsan Monsef, Mario Gonzalez, Won-Jae Yi, Jafar Saniie
2015 J jnl
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability.
Microelectron. Reliab.
Michal Jablonski, Riccardo Lucchini, Frederick Bossuyt, Thomas Vervust, Jan Vanfleteren, J. W. C. DeVries, Pasquale Vena, Mario Gonzalez
2015 — conf
Metallization scheme optimization of plastic-encapsulated electronic power devices.
ICICDT
Jan Ackaert, Tony Colpaert, Aditi Malik, Mario Gonzalez
2015 J jnl
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.
Microelectron. Reliab.
Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf
2015 — conf
Nonexistent harmonics generation phenomenon caused by the processing of DQ transformation in power quality applications.
ICIT
Mario Gonzalez, Victor M. Cárdenas, Ricardo Alvarez
2012 — conf
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
ICICDT
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
2011 J jnl
Design and implementation of flexible and stretchable systems.
Microelectron. Reliab.
Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans
2008 J jnl
Design of metal interconnects for stretchable electronic circuits.
Microelectron. Reliab.
Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde, Jan Vanfleteren
2007 J jnl
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
Microelectron. Reliab.
Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne
2006 — conf
Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier.
EMBC
Mathieu Vanden Bulcke, Kris Baert, Eric Beyne, Mario Gonzalez, Christophe Winters, Tomas Webers