| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Environ. Model. Softw.
|
| 2025 | J | jnl |
Comput. Electr. Eng.
|
| 2024 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2023 | C | conf |
TENCON
|
| 2022 | — | conf |
SPCOM
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
NCC
|
| 2022 | J | jnl |
Appl. Artif. Intell.
|
| 2022 | — | conf |
CVIP (1)
|
| 2021 | — | conf |
PReMI
|
| 2021 | J | jnl |
Int. J. Imaging Syst. Technol.
|
| 2021 | J | jnl |
Biomed. Signal Process. Control.
|
| 2020 | J | jnl |
IET Image Process.
|
| 2016 | — | conf |
RAIT
|