| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Access
|
| 2022 | C | conf |
IECON
|
| 2018 | J | jnl |
J. Ind. Inf. Integr.
|
| 2018 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2017 | C | conf |
IECON
|
| 2017 | — | conf |
NER
|
| 2017 | — | conf |
Electro-mechanical response of a 3D nerve bundle model to mechanical loads leading to axonal injury.
EMBC
|
| 2017 | — | conf |
NER
|
| 2015 | — | conf |
EMBC
|
| 2013 | — | conf |
BIODEVICES
|
| 2011 | — | conf |
BIODEVICES
|
| 2004 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2001 | J | jnl |
Microelectron. Reliab.
|