Madhava Sarma Vemuri

15 papers C 1Journal 6Unranked 8
YearRankTypeTitle / Venue / Authors
2024 — conf
Compact 6T-SRAM Using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration.
ISVLSI
Madhava Sarma Vemuri, Tanvir Ahmed, Umamaheswara Rao Tida
2024 — conf
Design Approaches and Consideration for a Reliable and Efficient Monolithic 3D Integration.
ISVLSI
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2024 J jnl
Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC.
IEEE Access
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter.
IEEE Access
Maliha Elma, Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 — conf
Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration.
MWSCAS
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration.
CoRR
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 — conf
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration.
SOCC
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration.
CoRR
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 — conf
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration.
ISQED
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration.
CoRR
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 C conf
Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology.
ICCD
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 J jnl
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits.
CoRR
Dawei Li, Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 — conf
Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter.
MWSCAS
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 — conf
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration.
MWSCAS
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 — conf
Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits.
SoCC
Umamaheswara Rao Tida, Madhava Sarma Vemuri