Léa Di Cioccio

14 papers Journal 3Unranked 11
YearRankTypeTitle / Venue / Authors
2022 — conf
Toward Eco-Design of a 5G mmWave Transmitarray Antenna Based on Life Cycle Assessment.
EuCNC
Josua Guérid, Jean-Baptiste Doré, Jacques Reverdy, Bruno Reig, Antonio Clemente, Léa Di Cioccio
2014 — conf
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO
3DIC
Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix
2013 — conf
Chip to wafer copper direct bonding electrical characterization and thermal cycling.
3DIC
Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
2013 — conf
Novel low temperature 3D wafer stacking technology for high density device integration.
ESSDERC
Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu
2013 — conf
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration.
ICICDT
Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio
2012 J jnl
Low temperature direct bonding: An attractive technique for heterostructures build-up.
Microelectron. Reliab.
H. Moriceau, F. Rieutord, Frank Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet
2011 — conf
200°C direct bonding copper interconnects : Electrical results and reliability.
3DIC
Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix
2011 — conf
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield.
3DIC
Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny
2010 — conf
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
3DIC
Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka
2009 — conf
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
3DIC
Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier
2009 — conf
First integration of Cu TSV using die-to-wafer direct bonding and planarization.
3DIC
Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon
2009 J jnl
System on Wafer: A New Silicon Concept in SiP.
Proc. IEEE
Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude
2007 J jnl
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly.
IEEE J. Solid State Circuits
Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri
2007 — conf
3D Capacitive Interconnections for High Speed Interchip Communication.
CICC
Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri